JPWO2024053103A1 - - Google Patents
Info
- Publication number
- JPWO2024053103A1 JPWO2024053103A1 JP2024545411A JP2024545411A JPWO2024053103A1 JP WO2024053103 A1 JPWO2024053103 A1 JP WO2024053103A1 JP 2024545411 A JP2024545411 A JP 2024545411A JP 2024545411 A JP2024545411 A JP 2024545411A JP WO2024053103 A1 JPWO2024053103 A1 JP WO2024053103A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/18—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of the types provided for in two or more different main groups of the same subclass of H10B, H10D, H10F, H10H, H10K or H10N
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/033933 WO2024053103A1 (ja) | 2022-09-09 | 2022-09-09 | Ｉｃブリッジ、ｉｃモジュールおよびｉｃモジュールの製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024053103A1 true JPWO2024053103A1 (enrdf_load_stackoverflow) | 2024-03-14 |
Family
ID=90192211
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024545411A Pending JPWO2024053103A1 (enrdf_load_stackoverflow) | 2022-09-09 | 2022-09-09 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2024053103A1 (enrdf_load_stackoverflow) |
| CN (1) | CN119768918A (enrdf_load_stackoverflow) |
| WO (1) | WO2024053103A1 (enrdf_load_stackoverflow) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007287801A (ja) * | 2006-04-13 | 2007-11-01 | Sony Corp | 電気・光混載三次元半導体モジュール及びハイブリット回路装置並びに携帯型電話機 |
| JP2011044654A (ja) * | 2009-08-24 | 2011-03-03 | Shinko Electric Ind Co Ltd | 半導体装置 |
| US10651126B2 (en) * | 2017-12-08 | 2020-05-12 | Applied Materials, Inc. | Methods and apparatus for wafer-level die bridge |
| US10867978B2 (en) * | 2018-12-11 | 2020-12-15 | Advanced Micro Devices, Inc. | Integrated circuit module with integrated discrete devices |
| US11296032B2 (en) * | 2020-05-28 | 2022-04-05 | Taiwan Semiconductor Manufacturing Company Limited | Silicon interposer including through-silicon via structures with enhanced overlay tolerance and methods of forming the same |
| US11482497B2 (en) * | 2021-01-14 | 2022-10-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package structure including a first die and a second die and a bridge die and method of forming the package structure |
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2022
- 2022-09-09 JP JP2024545411A patent/JPWO2024053103A1/ja active Pending
- 2022-09-09 CN CN202280099550.6A patent/CN119768918A/zh active Pending
- 2022-09-09 WO PCT/JP2022/033933 patent/WO2024053103A1/ja active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| CN119768918A (zh) | 2025-04-04 |
| WO2024053103A1 (ja) | 2024-03-14 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250218 |