JPWO2024053096A5 - - Google Patents
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- Publication number
- JPWO2024053096A5 JPWO2024053096A5 JP2024545405A JP2024545405A JPWO2024053096A5 JP WO2024053096 A5 JPWO2024053096 A5 JP WO2024053096A5 JP 2024545405 A JP2024545405 A JP 2024545405A JP 2024545405 A JP2024545405 A JP 2024545405A JP WO2024053096 A5 JPWO2024053096 A5 JP WO2024053096A5
- Authority
- JP
- Japan
- Prior art keywords
- solder
- conductor patterns
- electronic device
- portions
- interval
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 37
- 229910000679 solder Inorganic materials 0.000 claims description 14
- 239000003990 capacitor Substances 0.000 claims description 5
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 238000007747 plating Methods 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000005452 bending Methods 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/033914 WO2024053096A1 (ja) | 2022-09-09 | 2022-09-09 | 電子デバイス、内視鏡、および、電子デバイスの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024053096A1 JPWO2024053096A1 (https=) | 2024-03-14 |
| JPWO2024053096A5 true JPWO2024053096A5 (https=) | 2024-10-04 |
Family
ID=90192180
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024545405A Pending JPWO2024053096A1 (https=) | 2022-09-09 | 2022-09-09 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20250211845A1 (https=) |
| JP (1) | JPWO2024053096A1 (https=) |
| CN (1) | CN119816237A (https=) |
| WO (1) | WO2024053096A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004335657A (ja) * | 2003-05-06 | 2004-11-25 | Tdk Corp | 底面電極チップ部品の表面実装用ランドパターン、表面実装方法、緩衝基板及び電子部品 |
| JP2010004028A (ja) * | 2008-05-23 | 2010-01-07 | Shinko Electric Ind Co Ltd | 配線基板及びその製造方法、及び半導体装置 |
| JP2012064797A (ja) * | 2010-09-16 | 2012-03-29 | Hitachi Ltd | プリント配線板およびプリント基板 |
| CN106455933B (zh) * | 2014-06-20 | 2018-10-30 | 奥林巴斯株式会社 | 缆线连接构造和内窥镜装置 |
| JP2018061000A (ja) * | 2016-09-30 | 2018-04-12 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像素子及び撮像装置 |
| JP2018088442A (ja) * | 2016-11-28 | 2018-06-07 | 三菱電機株式会社 | プリント配線板およびその製造方法 |
-
2022
- 2022-09-09 WO PCT/JP2022/033914 patent/WO2024053096A1/ja not_active Ceased
- 2022-09-09 CN CN202280099795.9A patent/CN119816237A/zh active Pending
- 2022-09-09 JP JP2024545405A patent/JPWO2024053096A1/ja active Pending
-
2025
- 2025-03-07 US US19/073,612 patent/US20250211845A1/en active Pending
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