JPWO2024043008A1 - - Google Patents
Info
- Publication number
- JPWO2024043008A1 JPWO2024043008A1 JP2024542702A JP2024542702A JPWO2024043008A1 JP WO2024043008 A1 JPWO2024043008 A1 JP WO2024043008A1 JP 2024542702 A JP2024542702 A JP 2024542702A JP 2024542702 A JP2024542702 A JP 2024542702A JP WO2024043008 A1 JPWO2024043008 A1 JP WO2024043008A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/811—Multiple chips on leadframes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022131757 | 2022-08-22 | ||
| PCT/JP2023/027915 WO2024043008A1 (ja) | 2022-08-22 | 2023-07-31 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024043008A1 true JPWO2024043008A1 (https=) | 2024-02-29 |
| JPWO2024043008A5 JPWO2024043008A5 (https=) | 2025-05-02 |
Family
ID=90013025
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024542702A Pending JPWO2024043008A1 (https=) | 2022-08-22 | 2023-07-31 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20250192007A1 (https=) |
| JP (1) | JPWO2024043008A1 (https=) |
| WO (1) | WO2024043008A1 (https=) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005302951A (ja) * | 2004-04-09 | 2005-10-27 | Toshiba Corp | 電力用半導体装置パッケージ |
| JP2015056564A (ja) * | 2013-09-12 | 2015-03-23 | 古河電気工業株式会社 | 半導体装置及びその製造方法 |
-
2023
- 2023-07-31 WO PCT/JP2023/027915 patent/WO2024043008A1/ja not_active Ceased
- 2023-07-31 JP JP2024542702A patent/JPWO2024043008A1/ja active Pending
-
2025
- 2025-02-20 US US19/058,367 patent/US20250192007A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024043008A1 (ja) | 2024-02-29 |
| US20250192007A1 (en) | 2025-06-12 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250120 |