JPWO2024038736A1 - - Google Patents
Info
- Publication number
- JPWO2024038736A1 JPWO2024038736A1 JP2024541470A JP2024541470A JPWO2024038736A1 JP WO2024038736 A1 JPWO2024038736 A1 JP WO2024038736A1 JP 2024541470 A JP2024541470 A JP 2024541470A JP 2024541470 A JP2024541470 A JP 2024541470A JP WO2024038736 A1 JPWO2024038736 A1 JP WO2024038736A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022131065 | 2022-08-19 | ||
| PCT/JP2023/027137 WO2024038736A1 (ja) | 2022-08-19 | 2023-07-25 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024038736A1 true JPWO2024038736A1 (https=) | 2024-02-22 |
| JPWO2024038736A5 JPWO2024038736A5 (https=) | 2025-04-28 |
Family
ID=89941498
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024541470A Pending JPWO2024038736A1 (https=) | 2022-08-19 | 2023-07-25 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024038736A1 (https=) |
| WO (1) | WO2024038736A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012109435A (ja) * | 2010-11-18 | 2012-06-07 | Renesas Electronics Corp | 半導体装置の製造方法 |
| KR101555301B1 (ko) * | 2014-05-13 | 2015-09-23 | 페어차일드코리아반도체 주식회사 | 반도체 패키지 |
| JP2018107416A (ja) * | 2016-12-28 | 2018-07-05 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
| JP7527916B2 (ja) * | 2020-09-29 | 2024-08-05 | ローム株式会社 | 半導体装置 |
| DE112021006381B4 (de) * | 2021-01-04 | 2024-05-29 | Rohm Co., Ltd. | Halbleiterbauteil |
-
2023
- 2023-07-25 WO PCT/JP2023/027137 patent/WO2024038736A1/ja not_active Ceased
- 2023-07-25 JP JP2024541470A patent/JPWO2024038736A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024038736A1 (ja) | 2024-02-22 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250206 |