JPWO2024019174A1 - - Google Patents
Info
- Publication number
- JPWO2024019174A1 JPWO2024019174A1 JP2024535167A JP2024535167A JPWO2024019174A1 JP WO2024019174 A1 JPWO2024019174 A1 JP WO2024019174A1 JP 2024535167 A JP2024535167 A JP 2024535167A JP 2024535167 A JP2024535167 A JP 2024535167A JP WO2024019174 A1 JPWO2024019174 A1 JP WO2024019174A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
- H10W40/251—Organics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20463—Filling compound, e.g. potted resin
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
- H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
- H10W40/259—Ceramics or glasses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Ceramic Engineering (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/028528 WO2024018636A1 (ja) | 2022-07-22 | 2022-07-22 | 液状熱伝導材料、熱伝導シート作製用部材の組み合わせ、熱伝導シート、放熱装置及び熱伝導シートの製造方法 |
| PCT/JP2023/026893 WO2024019174A1 (ja) | 2022-07-22 | 2023-07-21 | 液状熱伝導材料、熱伝導シート作製用部材の組み合わせ、熱伝導シート、放熱装置及び熱伝導シートの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024019174A1 true JPWO2024019174A1 (https=) | 2024-01-25 |
| JPWO2024019174A5 JPWO2024019174A5 (https=) | 2025-04-16 |
Family
ID=89617310
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024535167A Pending JPWO2024019174A1 (https=) | 2022-07-22 | 2023-07-21 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20250331134A1 (https=) |
| JP (1) | JPWO2024019174A1 (https=) |
| KR (1) | KR20250038664A (https=) |
| CN (1) | CN119137736A (https=) |
| TW (1) | TW202424151A (https=) |
| WO (2) | WO2024018636A1 (https=) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3288029B2 (ja) | 2000-03-08 | 2002-06-04 | 北川工業株式会社 | 成形体、並びに、熱伝導材及びその製造方法 |
| JP2002026202A (ja) | 2000-06-29 | 2002-01-25 | Three M Innovative Properties Co | 熱伝導性シート及びその製造方法 |
| JP5740864B2 (ja) * | 2010-08-03 | 2015-07-01 | 日立化成株式会社 | 熱伝導シート、熱伝導シートの製造方法、及び熱伝導シートを用いた放熱装置 |
| JP5565758B2 (ja) * | 2011-06-29 | 2014-08-06 | 信越化学工業株式会社 | 硬化性でグリース状の熱伝導性シリコーン組成物および半導体装置 |
| JP2017143212A (ja) * | 2016-02-12 | 2017-08-17 | 日立化成株式会社 | 複合熱伝導シート及び放熱システム |
| JP6540613B2 (ja) * | 2016-06-22 | 2019-07-10 | 住友金属鉱山株式会社 | 熱伝導性グリース組成物およびその製造方法 |
| JP2021004283A (ja) * | 2019-06-25 | 2021-01-14 | 日本ゼオン株式会社 | 熱伝導シートおよびその製造方法 |
-
2022
- 2022-07-22 WO PCT/JP2022/028528 patent/WO2024018636A1/ja not_active Ceased
-
2023
- 2023-07-21 KR KR1020257003698A patent/KR20250038664A/ko active Pending
- 2023-07-21 TW TW112127420A patent/TW202424151A/zh unknown
- 2023-07-21 WO PCT/JP2023/026893 patent/WO2024019174A1/ja not_active Ceased
- 2023-07-21 CN CN202380037698.1A patent/CN119137736A/zh active Pending
- 2023-07-21 JP JP2024535167A patent/JPWO2024019174A1/ja active Pending
- 2023-07-21 US US18/861,880 patent/US20250331134A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20250331134A1 (en) | 2025-10-23 |
| WO2024018636A1 (ja) | 2024-01-25 |
| KR20250038664A (ko) | 2025-03-19 |
| CN119137736A (zh) | 2024-12-13 |
| WO2024019174A1 (ja) | 2024-01-25 |
| TW202424151A (zh) | 2024-06-16 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250121 |