JPWO2023282318A1 - - Google Patents

Info

Publication number
JPWO2023282318A1
JPWO2023282318A1 JP2023533183A JP2023533183A JPWO2023282318A1 JP WO2023282318 A1 JPWO2023282318 A1 JP WO2023282318A1 JP 2023533183 A JP2023533183 A JP 2023533183A JP 2023533183 A JP2023533183 A JP 2023533183A JP WO2023282318 A1 JPWO2023282318 A1 JP WO2023282318A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023533183A
Other languages
Japanese (ja)
Other versions
JPWO2023282318A5 (en
JP7409568B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023282318A1 publication Critical patent/JPWO2023282318A1/ja
Publication of JPWO2023282318A5 publication Critical patent/JPWO2023282318A5/ja
Application granted granted Critical
Publication of JP7409568B2 publication Critical patent/JP7409568B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
    • C09J123/30—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment by oxidation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
JP2023533183A 2021-07-09 2022-07-07 Adhesive compositions, adhesive sheets, electromagnetic shielding materials, laminates and printed wiring boards Active JP7409568B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021113991 2021-07-09
JP2021113991 2021-07-09
PCT/JP2022/026929 WO2023282318A1 (en) 2021-07-09 2022-07-07 Adhesive composition, adhesive sheet, electromagnetic-wave shielding material, laminate, and printed wiring board

Publications (3)

Publication Number Publication Date
JPWO2023282318A1 true JPWO2023282318A1 (en) 2023-01-12
JPWO2023282318A5 JPWO2023282318A5 (en) 2023-08-30
JP7409568B2 JP7409568B2 (en) 2024-01-09

Family

ID=84800778

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023533183A Active JP7409568B2 (en) 2021-07-09 2022-07-07 Adhesive compositions, adhesive sheets, electromagnetic shielding materials, laminates and printed wiring boards

Country Status (5)

Country Link
JP (1) JP7409568B2 (en)
KR (1) KR20240031943A (en)
CN (1) CN117500895A (en)
TW (1) TW202309213A (en)
WO (1) WO2023282318A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117362935A (en) * 2023-10-30 2024-01-09 广东龙宇新材料有限公司 Naphthol phenolic epoxy composition added with aziridine crosslinking agent and application thereof

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013193253A (en) * 2012-03-16 2013-09-30 Yamaichi Electronics Co Ltd Electromagnetic shielding coverlay film, flexible wiring board and method for manufacturing the same
WO2014147903A1 (en) 2013-03-22 2014-09-25 東亞合成株式会社 Adhesive composition, and coverlay film and flexible copper-clad laminate using same
JP6259681B2 (en) 2014-03-12 2018-01-10 日本アビオニクス株式会社 Seam welding equipment
CN107075335B (en) 2014-09-24 2020-02-14 东亚合成株式会社 Adhesive composition and adhesive layer-equipped laminate using same
JP6927206B2 (en) 2016-06-02 2021-08-25 昭和電工マテリアルズ株式会社 Thermosetting resin composition, prepreg, laminated board, printed wiring board and high-speed communication compatible module
JP6973411B2 (en) * 2016-12-22 2021-11-24 東亞合成株式会社 Adhesive composition and coverlay film using it, bonding sheet, copper-clad laminate and electromagnetic wave shielding material
WO2020158360A1 (en) * 2019-01-29 2020-08-06 東洋紡株式会社 Adhesive composition containing a dimer diol copolymer polyimide urethane resin
WO2021070606A1 (en) * 2019-10-08 2021-04-15 東洋紡株式会社 Polyolefin-based adhesive composition
CN114514300B (en) * 2019-11-29 2023-11-14 东洋纺Mc株式会社 Adhesive composition, adhesive sheet, laminate, and printed wiring board
KR20210077613A (en) * 2019-12-16 2021-06-25 아라까와 가가꾸 고교 가부시끼가이샤 Adhesive composition, film-like adhesive material, adhesive layer, adhesive sheet, copper foil with resin, copper-clad laminate, printed circuit board, and multilayer wiring board and method for manufacturing the same

Also Published As

Publication number Publication date
KR20240031943A (en) 2024-03-08
TW202309213A (en) 2023-03-01
CN117500895A (en) 2024-02-02
WO2023282318A1 (en) 2023-01-12
JP7409568B2 (en) 2024-01-09

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