JPWO2023282123A1 - - Google Patents

Info

Publication number
JPWO2023282123A1
JPWO2023282123A1 JP2023533548A JP2023533548A JPWO2023282123A1 JP WO2023282123 A1 JPWO2023282123 A1 JP WO2023282123A1 JP 2023533548 A JP2023533548 A JP 2023533548A JP 2023533548 A JP2023533548 A JP 2023533548A JP WO2023282123 A1 JPWO2023282123 A1 JP WO2023282123A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023533548A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023282123A1 publication Critical patent/JPWO2023282123A1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/40—Removing or ejecting moulded articles
    • B29C45/42—Removing or ejecting moulded articles using means movable from outside the mould between mould parts, e.g. robots
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
JP2023533548A 2021-07-07 2022-06-28 Pending JPWO2023282123A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021113008 2021-07-07
PCT/JP2022/025718 WO2023282123A1 (ja) 2021-07-07 2022-06-28 樹脂封止装置及び清掃方法

Publications (1)

Publication Number Publication Date
JPWO2023282123A1 true JPWO2023282123A1 (ja) 2023-01-12

Family

ID=84801573

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023533548A Pending JPWO2023282123A1 (ja) 2021-07-07 2022-06-28

Country Status (3)

Country Link
JP (1) JPWO2023282123A1 (ja)
TW (1) TWI808730B (ja)
WO (1) WO2023282123A1 (ja)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3572287B2 (ja) * 2001-11-29 2004-09-29 株式会社サイネックス 樹脂封止装置
JP4362296B2 (ja) * 2003-02-25 2009-11-11 アピックヤマダ株式会社 ワーク搬入装置及び樹脂封止装置
JP2006088006A (ja) * 2004-09-22 2006-04-06 Konica Minolta Holdings Inc 表面処理装置
JP2012217876A (ja) * 2011-04-04 2012-11-12 National Institute Of Advanced Industrial Science & Technology 超音波を用いた非接触クリーニング方法

Also Published As

Publication number Publication date
WO2023282123A1 (ja) 2023-01-12
TWI808730B (zh) 2023-07-11
TW202302318A (zh) 2023-01-16

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Legal Events

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