JPWO2023281775A1 - - Google Patents

Info

Publication number
JPWO2023281775A1
JPWO2023281775A1 JP2023533044A JP2023533044A JPWO2023281775A1 JP WO2023281775 A1 JPWO2023281775 A1 JP WO2023281775A1 JP 2023533044 A JP2023533044 A JP 2023533044A JP 2023533044 A JP2023533044 A JP 2023533044A JP WO2023281775 A1 JPWO2023281775 A1 JP WO2023281775A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023533044A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023281775A1 publication Critical patent/JPWO2023281775A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/16—Electroplating with layers of varying thickness
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
JP2023533044A 2021-07-09 2022-01-14 Pending JPWO2023281775A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021114582 2021-07-09
PCT/JP2022/001218 WO2023281775A1 (en) 2021-07-09 2022-01-14 Surface-treated copper foil, copper-clad laminate, and printed wiring board

Publications (1)

Publication Number Publication Date
JPWO2023281775A1 true JPWO2023281775A1 (en) 2023-01-12

Family

ID=84801729

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023533044A Pending JPWO2023281775A1 (en) 2021-07-09 2022-01-14

Country Status (5)

Country Link
JP (1) JPWO2023281775A1 (en)
KR (1) KR20230113357A (en)
CN (1) CN117062943A (en)
TW (1) TWI802225B (en)
WO (1) WO2023281775A1 (en)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010061736A1 (en) * 2008-11-25 2010-06-03 日鉱金属株式会社 Copper foil for printed circuit
EP2557204A1 (en) * 2010-05-07 2013-02-13 JX Nippon Mining & Metals Corp. Copper foil for printed circuit
JP2012112009A (en) 2010-11-26 2012-06-14 Hitachi Cable Ltd Copper foil, and method for producing copper foil
JP2014152352A (en) * 2013-02-06 2014-08-25 Sh Copper Products Corp Composite copper foil and production method thereof
WO2017006739A1 (en) * 2015-07-03 2017-01-12 三井金属鉱業株式会社 Roughened copper foil, copper-clad laminate and printed wiring board
JP6200042B2 (en) * 2015-08-06 2017-09-20 Ｊｘ金属株式会社 Copper foil with carrier, laminate, printed wiring board manufacturing method and electronic device manufacturing method
JP7356209B2 (en) * 2017-03-31 2023-10-04 Ｊｘ金属株式会社 Surface-treated copper foil, surface-treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring boards, and method for manufacturing electronic devices
JP7114499B2 (en) * 2019-01-30 2022-08-08 Ｊｘ金属株式会社 Surface treated copper foil, copper clad laminate and printed wiring board
US10581081B1 (en) * 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery
JP6816193B2 (en) * 2019-03-26 2021-01-20 古河電気工業株式会社 Surface-treated copper foil, and copper-clad laminates and printed wiring boards using this
JP2021095596A (en) * 2019-12-13 2021-06-24 Ｊｘ金属株式会社 Surface-treated copper foil, copper-clad laminate, and printed wiring board
JP7300976B2 (en) * 2019-12-13 2023-06-30 Ｊｘ金属株式会社 Surface treated copper foil, copper clad laminate and printed wiring board

Also Published As

Publication number Publication date
KR20230113357A (en) 2023-07-28
CN117062943A (en) 2023-11-14
WO2023281775A1 (en) 2023-01-12
TWI802225B (en) 2023-05-11
TW202304268A (en) 2023-01-16

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240130