JPWO2023276622A1 - - Google Patents

Info

Publication number
JPWO2023276622A1
JPWO2023276622A1 JP2023531760A JP2023531760A JPWO2023276622A1 JP WO2023276622 A1 JPWO2023276622 A1 JP WO2023276622A1 JP 2023531760 A JP2023531760 A JP 2023531760A JP 2023531760 A JP2023531760 A JP 2023531760A JP WO2023276622 A1 JPWO2023276622 A1 JP WO2023276622A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023531760A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023276622A1 publication Critical patent/JPWO2023276622A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Integrated Circuits (AREA)
  • Epoxy Resins (AREA)
JP2023531760A 2021-06-29 2022-06-10 Pending JPWO2023276622A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021107421 2021-06-29
PCT/JP2022/023511 WO2023276622A1 (ja) 2021-06-29 2022-06-10 光導波路用樹脂組成物、並びに、それを用いたドライフィルム及び光導波路

Publications (1)

Publication Number Publication Date
JPWO2023276622A1 true JPWO2023276622A1 (ja) 2023-01-05

Family

ID=84691710

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023531760A Pending JPWO2023276622A1 (ja) 2021-06-29 2022-06-10

Country Status (3)

Country Link
JP (1) JPWO2023276622A1 (ja)
CN (1) CN117581129A (ja)
WO (1) WO2023276622A1 (ja)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61117501A (ja) * 1984-11-14 1986-06-04 Sumitomo Bakelite Co Ltd 近赤外光透過材料
WO2002088221A1 (en) * 2001-04-27 2002-11-07 The University Of Sydney Materials for optical applications
JP4205368B2 (ja) * 2002-06-11 2009-01-07 株式会社Ａｄｅｋａ 光学材料用硬化性組成物
JP4547188B2 (ja) * 2004-05-25 2010-09-22 太陽インキ製造株式会社 光導波路材料用光硬化性・熱硬化樹脂組成物、及びその硬化物並びに光・電気混載基板
JP2009051917A (ja) * 2007-08-24 2009-03-12 Hitachi Chem Co Ltd 光学材料用樹脂組成物、光学材料用樹脂フィルム及びこれらを用いた光導波路
JP4894719B2 (ja) * 2007-10-25 2012-03-14 パナソニック電工株式会社 光導波路

Also Published As

Publication number Publication date
CN117581129A (zh) 2024-02-20
WO2023276622A1 (ja) 2023-01-05

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