JPWO2023248416A1 - - Google Patents
Info
- Publication number
- JPWO2023248416A1 JPWO2023248416A1 JP2022562906A JP2022562906A JPWO2023248416A1 JP WO2023248416 A1 JPWO2023248416 A1 JP WO2023248416A1 JP 2022562906 A JP2022562906 A JP 2022562906A JP 2022562906 A JP2022562906 A JP 2022562906A JP WO2023248416 A1 JPWO2023248416 A1 JP WO2023248416A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
- H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/025061 WO2023248416A1 (ja) | 2022-06-23 | 2022-06-23 | プリウェットモジュール、およびプリウェット方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023248416A1 true JPWO2023248416A1 (https=) | 2023-12-28 |
| JPWO2023248416A5 JPWO2023248416A5 (https=) | 2024-05-28 |
Family
ID=89379289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022562906A Pending JPWO2023248416A1 (https=) | 2022-06-23 | 2022-06-23 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2023248416A1 (https=) |
| WO (1) | WO2023248416A1 (https=) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005264245A (ja) * | 2004-03-18 | 2005-09-29 | Ebara Corp | 基板の湿式処理方法及び処理装置 |
| JP2014139341A (ja) * | 2012-12-11 | 2014-07-31 | Novellus Systems Incorporated | 電気充填真空めっきセル |
| JP2018104799A (ja) * | 2016-12-28 | 2018-07-05 | 株式会社荏原製作所 | 基板を処理するための方法および装置 |
| JP2020043333A (ja) * | 2018-09-06 | 2020-03-19 | 株式会社荏原製作所 | 基板処理装置 |
| JP7008863B1 (ja) * | 2021-05-31 | 2022-01-25 | 株式会社荏原製作所 | プリウェットモジュール、脱気液循環システム、およびプリウェット方法 |
| JP2022059253A (ja) * | 2020-10-01 | 2022-04-13 | 株式会社荏原製作所 | めっき装置及びめっき方法 |
-
2022
- 2022-06-23 JP JP2022562906A patent/JPWO2023248416A1/ja active Pending
- 2022-06-23 WO PCT/JP2022/025061 patent/WO2023248416A1/ja not_active Ceased
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005264245A (ja) * | 2004-03-18 | 2005-09-29 | Ebara Corp | 基板の湿式処理方法及び処理装置 |
| JP2014139341A (ja) * | 2012-12-11 | 2014-07-31 | Novellus Systems Incorporated | 電気充填真空めっきセル |
| JP2018104799A (ja) * | 2016-12-28 | 2018-07-05 | 株式会社荏原製作所 | 基板を処理するための方法および装置 |
| JP2020043333A (ja) * | 2018-09-06 | 2020-03-19 | 株式会社荏原製作所 | 基板処理装置 |
| JP2022059253A (ja) * | 2020-10-01 | 2022-04-13 | 株式会社荏原製作所 | めっき装置及びめっき方法 |
| JP7008863B1 (ja) * | 2021-05-31 | 2022-01-25 | 株式会社荏原製作所 | プリウェットモジュール、脱気液循環システム、およびプリウェット方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023248416A1 (ja) | 2023-12-28 |
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