JPWO2023243575A1 - - Google Patents

Info

Publication number
JPWO2023243575A1
JPWO2023243575A1 JP2024528827A JP2024528827A JPWO2023243575A1 JP WO2023243575 A1 JPWO2023243575 A1 JP WO2023243575A1 JP 2024528827 A JP2024528827 A JP 2024528827A JP 2024528827 A JP2024528827 A JP 2024528827A JP WO2023243575 A1 JPWO2023243575 A1 JP WO2023243575A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024528827A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023243575A1 publication Critical patent/JPWO2023243575A1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2024528827A 2022-06-13 2023-06-12 Pending JPWO2023243575A1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022094828 2022-06-13
JP2023008559 2023-01-24
PCT/JP2023/021647 WO2023243575A1 (ja) 2022-06-13 2023-06-12 噴流はんだ付け装置

Publications (1)

Publication Number Publication Date
JPWO2023243575A1 true JPWO2023243575A1 (ja) 2023-12-21

Family

ID=89191271

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024528827A Pending JPWO2023243575A1 (ja) 2022-06-13 2023-06-12

Country Status (3)

Country Link
JP (1) JPWO2023243575A1 (ja)
TW (1) TW202406653A (ja)
WO (1) WO2023243575A1 (ja)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61137669A (ja) * 1984-12-11 1986-06-25 Tamura Seisakusho Co Ltd 噴流式はんだ付け装置
JP3398538B2 (ja) * 1995-12-28 2003-04-21 日本電熱計器株式会社 はんだ付け装置におけるプロセスデータの収集方法
JP2000340938A (ja) * 1999-05-27 2000-12-08 Nihon Dennetsu Keiki Co Ltd はんだ付け方法およびはんだ付け装置
JP4332281B2 (ja) * 2000-04-26 2009-09-16 株式会社日立製作所 電子装置の製造方法およびはんだ付け装置
JP2002329956A (ja) * 2001-04-27 2002-11-15 Ricoh Co Ltd はんだ付け方法および該はんだ付け方法を用いて製造した電子回路基板ならびに電子機器
JP2004111472A (ja) * 2002-09-13 2004-04-08 Ryusyo Industrial Co Ltd フロー半田付け方法およびフロー半田付け装置
JP2020163403A (ja) * 2019-03-28 2020-10-08 太陽誘電株式会社 熱圧着装置及び電子部品の製造方法

Also Published As

Publication number Publication date
WO2023243575A1 (ja) 2023-12-21
TW202406653A (zh) 2024-02-16

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