JPWO2023233591A1 - - Google Patents

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Publication number
JPWO2023233591A1
JPWO2023233591A1 JP2022556093A JP2022556093A JPWO2023233591A1 JP WO2023233591 A1 JPWO2023233591 A1 JP WO2023233591A1 JP 2022556093 A JP2022556093 A JP 2022556093A JP 2022556093 A JP2022556093 A JP 2022556093A JP WO2023233591 A1 JPWO2023233591 A1 JP WO2023233591A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022556093A
Other versions
JPWO2023233591A5 (ja
JP7184230B1 (ja
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Publication of JP7184230B1 publication Critical patent/JP7184230B1/ja
Publication of JPWO2023233591A1 publication Critical patent/JPWO2023233591A1/ja
Publication of JPWO2023233591A5 publication Critical patent/JPWO2023233591A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
JP2022556093A 2022-06-01 2022-06-01 半導体装置および半導体装置の製造方法 Active JP7184230B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/022338 WO2023233591A1 (ja) 2022-06-01 2022-06-01 半導体装置および半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP7184230B1 JP7184230B1 (ja) 2022-12-06
JPWO2023233591A1 true JPWO2023233591A1 (ja) 2023-12-07
JPWO2023233591A5 JPWO2023233591A5 (ja) 2024-05-13

Family

ID=84327887

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022556093A Active JP7184230B1 (ja) 2022-06-01 2022-06-01 半導体装置および半導体装置の製造方法

Country Status (2)

Country Link
JP (1) JP7184230B1 (ja)
WO (1) WO2023233591A1 (ja)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5346272B2 (ja) * 2009-12-01 2013-11-20 三ツ星ベルト株式会社 素子搭載基板及び発光装置
JP2015176971A (ja) * 2014-03-14 2015-10-05 三菱電機株式会社 半導体パッケージ、およびその製造方法
US10104759B2 (en) * 2016-11-29 2018-10-16 Nxp Usa, Inc. Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereof
DE112019008007T5 (de) * 2019-12-26 2022-10-27 Mitsubishi Electric Corporation Leistungsmodul und leistungswandlereinheit

Also Published As

Publication number Publication date
WO2023233591A1 (ja) 2023-12-07
JP7184230B1 (ja) 2022-12-06

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