JPWO2023210735A1 - - Google Patents

Info

Publication number
JPWO2023210735A1
JPWO2023210735A1 JP2024518021A JP2024518021A JPWO2023210735A1 JP WO2023210735 A1 JPWO2023210735 A1 JP WO2023210735A1 JP 2024518021 A JP2024518021 A JP 2024518021A JP 2024518021 A JP2024518021 A JP 2024518021A JP WO2023210735 A1 JPWO2023210735 A1 JP WO2023210735A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024518021A
Other languages
Japanese (ja)
Other versions
JPWO2023210735A5 (https=
JP7557107B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of JPWO2023210735A1 publication Critical patent/JPWO2023210735A1/ja
Publication of JPWO2023210735A5 publication Critical patent/JPWO2023210735A5/ja
Application granted granted Critical
Publication of JP7557107B2 publication Critical patent/JP7557107B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
JP2024518021A 2022-04-28 2023-04-27 セラミック配線部材 Active JP7557107B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPPCT/JP2022/019340 2022-04-28
JP2022019340 2022-04-28
PCT/JP2023/016613 WO2023210735A1 (ja) 2022-04-28 2023-04-27 セラミック配線部材

Publications (3)

Publication Number Publication Date
JPWO2023210735A1 true JPWO2023210735A1 (https=) 2023-11-02
JPWO2023210735A5 JPWO2023210735A5 (https=) 2024-05-22
JP7557107B2 JP7557107B2 (ja) 2024-09-26

Family

ID=88518797

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024518021A Active JP7557107B2 (ja) 2022-04-28 2023-04-27 セラミック配線部材

Country Status (4)

Country Link
JP (1) JP7557107B2 (https=)
CN (1) CN117322140A (https=)
TW (1) TWI852518B (https=)
WO (1) WO2023210735A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0766009A (ja) * 1993-08-30 1995-03-10 Mitsubishi Materials Corp サーミスタ素子及びその製造方法
JP2010035078A (ja) * 2008-07-31 2010-02-12 Kyocera Kinseki Corp 圧電発振器
JP2010073847A (ja) * 2008-09-18 2010-04-02 Sony Corp Ｐｔｃサーミスタ素子及びその製造方法、並びに２次電池セル及びその製造方法
WO2016080075A1 (ja) * 2014-11-21 2016-05-26 株式会社大真空 圧電振動デバイス

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111180572A (zh) * 2015-03-11 2020-05-19 株式会社大真空 压电器件

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0766009A (ja) * 1993-08-30 1995-03-10 Mitsubishi Materials Corp サーミスタ素子及びその製造方法
JP2010035078A (ja) * 2008-07-31 2010-02-12 Kyocera Kinseki Corp 圧電発振器
JP2010073847A (ja) * 2008-09-18 2010-04-02 Sony Corp Ｐｔｃサーミスタ素子及びその製造方法、並びに２次電池セル及びその製造方法
WO2016080075A1 (ja) * 2014-11-21 2016-05-26 株式会社大真空 圧電振動デバイス

Also Published As

Publication number Publication date
CN117322140A (zh) 2023-12-29
TWI852518B (zh) 2024-08-11
TW202408325A (zh) 2024-02-16
JP7557107B2 (ja) 2024-09-26
WO2023210735A1 (ja) 2023-11-02

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