JPWO2023190677A1 - - Google Patents
Info
- Publication number
- JPWO2023190677A1 JPWO2023190677A1 JP2024512672A JP2024512672A JPWO2023190677A1 JP WO2023190677 A1 JPWO2023190677 A1 JP WO2023190677A1 JP 2024512672 A JP2024512672 A JP 2024512672A JP 2024512672 A JP2024512672 A JP 2024512672A JP WO2023190677 A1 JPWO2023190677 A1 JP WO2023190677A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02086—Means for compensation or elimination of undesirable effects
- H03H9/02133—Means for compensation or elimination of undesirable effects of stress
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02157—Dimensional parameters, e.g. ratio between two dimension parameters, length, width or thickness
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
- H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
- H03H9/175—Acoustic mirrors
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022058814 | 2022-03-31 | ||
| PCT/JP2023/012784 WO2023190677A1 (ja) | 2022-03-31 | 2023-03-29 | 音響多層膜、高周波フィルタデバイス、及びバルク弾性波フィルタデバイス |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023190677A1 true JPWO2023190677A1 (https=) | 2023-10-05 |
| JPWO2023190677A5 JPWO2023190677A5 (https=) | 2026-02-10 |
Family
ID=88202021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024512672A Withdrawn JPWO2023190677A1 (https=) | 2022-03-31 | 2023-03-29 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20250219611A1 (https=) |
| JP (1) | JPWO2023190677A1 (https=) |
| TW (1) | TW202406299A (https=) |
| WO (1) | WO2023190677A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025205107A1 (ja) * | 2024-03-28 | 2025-10-02 | 日東電工株式会社 | 圧電デバイス及び電子機器 |
| CN118249774B (zh) * | 2024-05-21 | 2024-09-20 | 河源市艾佛光通科技有限公司 | 一种体声波谐振器及其制备方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005197983A (ja) * | 2004-01-07 | 2005-07-21 | Tdk Corp | 薄膜バルク波共振器 |
| JP4693407B2 (ja) * | 2004-12-28 | 2011-06-01 | 京セラキンセキ株式会社 | 圧電薄膜デバイス及びその製造方法 |
| JP4846477B2 (ja) * | 2006-07-26 | 2011-12-28 | パナソニック株式会社 | 薄膜音響共振器の製造方法 |
| JP2008187303A (ja) * | 2007-01-26 | 2008-08-14 | Matsushita Electric Works Ltd | 共振装置の製造方法 |
| US8586195B2 (en) * | 2007-07-11 | 2013-11-19 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Method for forming an acoustic mirror with reduced metal layer roughness and related structure |
| US7869187B2 (en) * | 2007-09-04 | 2011-01-11 | Paratek Microwave, Inc. | Acoustic bandgap structures adapted to suppress parasitic resonances in tunable ferroelectric capacitors and method of operation and fabrication therefore |
-
2023
- 2023-03-29 WO PCT/JP2023/012784 patent/WO2023190677A1/ja not_active Ceased
- 2023-03-29 US US18/851,345 patent/US20250219611A1/en active Pending
- 2023-03-29 JP JP2024512672A patent/JPWO2023190677A1/ja not_active Withdrawn
- 2023-03-29 TW TW112111958A patent/TW202406299A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023190677A1 (ja) | 2023-10-05 |
| US20250219611A1 (en) | 2025-07-03 |
| TW202406299A (zh) | 2024-02-01 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20260202 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20260202 |
|
| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20260415 |