JPWO2023190528A1 - - Google Patents
Info
- Publication number
- JPWO2023190528A1 JPWO2023190528A1 JP2024512573A JP2024512573A JPWO2023190528A1 JP WO2023190528 A1 JPWO2023190528 A1 JP WO2023190528A1 JP 2024512573 A JP2024512573 A JP 2024512573A JP 2024512573 A JP2024512573 A JP 2024512573A JP WO2023190528 A1 JPWO2023190528 A1 JP WO2023190528A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B21/00—Nitrogen; Compounds thereof
- C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
- C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B21/00—Nitrogen; Compounds thereof
- C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
- C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
- C01B21/0648—After-treatment, e.g. grinding, purification
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B21/00—Nitrogen; Compounds thereof
- C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
- C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
- C01B21/0645—Preparation by carboreductive nitridation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/50—Agglomerated particles
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/12—Surface area
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/80—Compositional purity
- C01P2006/82—Compositional purity water content
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/90—Other properties not specified above
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/006—Additives being defined by their surface area
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Ceramic Products (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022055202 | 2022-03-30 | ||
| JP2022055202 | 2022-03-30 | ||
| PCT/JP2023/012545 WO2023190528A1 (ja) | 2022-03-30 | 2023-03-28 | 窒化ホウ素粉末、樹脂組成物及び窒化ホウ素粉末の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023190528A1 true JPWO2023190528A1 (https=) | 2023-10-05 |
| JP7769784B2 JP7769784B2 (ja) | 2025-11-13 |
Family
ID=88201752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024512573A Active JP7769784B2 (ja) | 2022-03-30 | 2023-03-28 | 窒化ホウ素粉末、樹脂組成物及び窒化ホウ素粉末の製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250215192A1 (https=) |
| JP (1) | JP7769784B2 (https=) |
| KR (1) | KR20240153387A (https=) |
| CN (1) | CN118660861A (https=) |
| WO (1) | WO2023190528A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2026061808A (ja) * | 2024-09-30 | 2026-04-09 | デンカ株式会社 | 積層体及び回路基板 |
| JP2026061810A (ja) * | 2024-09-30 | 2026-04-09 | デンカ株式会社 | 積層体及び回路基板 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011043082A1 (ja) * | 2009-10-09 | 2011-04-14 | 水島合金鉄株式会社 | 六方晶窒化ホウ素粉末およびその製造方法 |
| WO2018124126A1 (ja) * | 2016-12-28 | 2018-07-05 | 昭和電工株式会社 | 六方晶窒化ホウ素粉末、その製造方法、樹脂組成物及び樹脂シート |
| WO2020004600A1 (ja) * | 2018-06-29 | 2020-01-02 | デンカ株式会社 | 塊状窒化ホウ素粒子、窒化ホウ素粉末、窒化ホウ素粉末の製造方法、樹脂組成物、及び放熱部材 |
| WO2020196679A1 (ja) * | 2019-03-28 | 2020-10-01 | デンカ株式会社 | 窒化ホウ素粉末及びその製造方法、並びに、複合材及び放熱部材 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6493226B2 (ja) | 2014-02-05 | 2019-04-03 | 三菱ケミカル株式会社 | 窒化ホウ素凝集粒子、窒化ホウ素凝集粒子の製造方法、該窒化ホウ素凝集粒子含有樹脂組成物、成形体、及びシート |
| JP7606926B2 (ja) * | 2021-05-20 | 2024-12-26 | デンカ株式会社 | 窒化ホウ素粉末、及び窒化ホウ素粉末の製造方法、並びに、樹脂組成物 |
-
2023
- 2023-03-28 CN CN202380020357.3A patent/CN118660861A/zh active Pending
- 2023-03-28 WO PCT/JP2023/012545 patent/WO2023190528A1/ja not_active Ceased
- 2023-03-28 US US18/850,543 patent/US20250215192A1/en active Pending
- 2023-03-28 JP JP2024512573A patent/JP7769784B2/ja active Active
- 2023-03-28 KR KR1020247032264A patent/KR20240153387A/ko active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011043082A1 (ja) * | 2009-10-09 | 2011-04-14 | 水島合金鉄株式会社 | 六方晶窒化ホウ素粉末およびその製造方法 |
| WO2018124126A1 (ja) * | 2016-12-28 | 2018-07-05 | 昭和電工株式会社 | 六方晶窒化ホウ素粉末、その製造方法、樹脂組成物及び樹脂シート |
| WO2020004600A1 (ja) * | 2018-06-29 | 2020-01-02 | デンカ株式会社 | 塊状窒化ホウ素粒子、窒化ホウ素粉末、窒化ホウ素粉末の製造方法、樹脂組成物、及び放熱部材 |
| WO2020196679A1 (ja) * | 2019-03-28 | 2020-10-01 | デンカ株式会社 | 窒化ホウ素粉末及びその製造方法、並びに、複合材及び放熱部材 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023190528A1 (ja) | 2023-10-05 |
| KR20240153387A (ko) | 2024-10-22 |
| CN118660861A (zh) | 2024-09-17 |
| US20250215192A1 (en) | 2025-07-03 |
| JP7769784B2 (ja) | 2025-11-13 |
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