JPWO2023190439A1 - - Google Patents

Info

Publication number
JPWO2023190439A1
JPWO2023190439A1 JP2024512515A JP2024512515A JPWO2023190439A1 JP WO2023190439 A1 JPWO2023190439 A1 JP WO2023190439A1 JP 2024512515 A JP2024512515 A JP 2024512515A JP 2024512515 A JP2024512515 A JP 2024512515A JP WO2023190439 A1 JPWO2023190439 A1 JP WO2023190439A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024512515A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023190439A1 publication Critical patent/JPWO2023190439A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2024512515A 2022-03-29 2023-03-28 Pending JPWO2023190439A1 (enrdf_load_stackoverflow)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022053816 2022-03-29
PCT/JP2023/012376 WO2023190439A1 (ja) 2022-03-29 2023-03-28 二液硬化型組成物セット、硬化物及び電子機器

Publications (1)

Publication Number Publication Date
JPWO2023190439A1 true JPWO2023190439A1 (enrdf_load_stackoverflow) 2023-10-05

Family

ID=88202426

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024512515A Pending JPWO2023190439A1 (enrdf_load_stackoverflow) 2022-03-29 2023-03-28

Country Status (3)

Country Link
JP (1) JPWO2023190439A1 (enrdf_load_stackoverflow)
TW (1) TW202348731A (enrdf_load_stackoverflow)
WO (1) WO2023190439A1 (enrdf_load_stackoverflow)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003034784A (ja) * 2001-07-24 2003-02-07 Lion Corp 撥水処理剤
JP2016121350A (ja) * 2014-12-24 2016-07-07 東洋インキＳｃホールディングス株式会社 シリカ分散体、および、活性エネルギー線硬化性樹脂組成物
WO2020080256A1 (ja) * 2018-10-15 2020-04-23 デンカ株式会社 二液硬化型組成物セット、熱伝導性硬化物及び電子機器
WO2021246397A1 (ja) * 2020-06-05 2021-12-09 デンカ株式会社 二液硬化型熱伝導性グリース用組成物、熱伝導性グリース、および電子機器

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022075306A1 (ja) * 2020-10-05 2022-04-14 デンカ株式会社 熱伝導性樹脂組成物及び電子機器

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003034784A (ja) * 2001-07-24 2003-02-07 Lion Corp 撥水処理剤
JP2016121350A (ja) * 2014-12-24 2016-07-07 東洋インキＳｃホールディングス株式会社 シリカ分散体、および、活性エネルギー線硬化性樹脂組成物
WO2020080256A1 (ja) * 2018-10-15 2020-04-23 デンカ株式会社 二液硬化型組成物セット、熱伝導性硬化物及び電子機器
WO2021246397A1 (ja) * 2020-06-05 2021-12-09 デンカ株式会社 二液硬化型熱伝導性グリース用組成物、熱伝導性グリース、および電子機器

Also Published As

Publication number Publication date
WO2023190439A1 (ja) 2023-10-05
TW202348731A (zh) 2023-12-16

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