TW202348731A - 二液硬化型組合物組、硬化物及電子機器 - Google Patents

二液硬化型組合物組、硬化物及電子機器 Download PDF

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Publication number
TW202348731A
TW202348731A TW112111878A TW112111878A TW202348731A TW 202348731 A TW202348731 A TW 202348731A TW 112111878 A TW112111878 A TW 112111878A TW 112111878 A TW112111878 A TW 112111878A TW 202348731 A TW202348731 A TW 202348731A
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TW
Taiwan
Prior art keywords
agent
mentioned
weight
copolymer
monomer unit
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TW112111878A
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English (en)
Chinese (zh)
Inventor
小野塚正雄
金井朋之
Original Assignee
日商電化股份有限公司
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Application filed by 日商電化股份有限公司 filed Critical 日商電化股份有限公司
Publication of TW202348731A publication Critical patent/TW202348731A/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW112111878A 2022-03-29 2023-03-29 二液硬化型組合物組、硬化物及電子機器 TW202348731A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022053816 2022-03-29
JP2022-053816 2022-03-29

Publications (1)

Publication Number Publication Date
TW202348731A true TW202348731A (zh) 2023-12-16

Family

ID=88202426

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112111878A TW202348731A (zh) 2022-03-29 2023-03-29 二液硬化型組合物組、硬化物及電子機器

Country Status (3)

Country Link
JP (1) JPWO2023190439A1 (enrdf_load_stackoverflow)
TW (1) TW202348731A (enrdf_load_stackoverflow)
WO (1) WO2023190439A1 (enrdf_load_stackoverflow)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003034784A (ja) * 2001-07-24 2003-02-07 Lion Corp 撥水処理剤
JP6582967B2 (ja) * 2014-12-24 2019-10-02 東洋インキＳｃホールディングス株式会社 シリカ分散体、および、活性エネルギー線硬化性樹脂組成物
JP6727471B1 (ja) * 2018-10-15 2020-07-22 デンカ株式会社 二液硬化型組成物セット、熱伝導性硬化物及び電子機器
US20230272218A1 (en) * 2020-06-05 2023-08-31 Denka Company Limited Two-agent curable heat conductive grease composition, heat conductive grease, and electronic device
WO2022075306A1 (ja) * 2020-10-05 2022-04-14 デンカ株式会社 熱伝導性樹脂組成物及び電子機器

Also Published As

Publication number Publication date
WO2023190439A1 (ja) 2023-10-05
JPWO2023190439A1 (enrdf_load_stackoverflow) 2023-10-05

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