JPWO2023181831A1 - - Google Patents
Info
- Publication number
- JPWO2023181831A1 JPWO2023181831A1 JP2024509905A JP2024509905A JPWO2023181831A1 JP WO2023181831 A1 JPWO2023181831 A1 JP WO2023181831A1 JP 2024509905 A JP2024509905 A JP 2024509905A JP 2024509905 A JP2024509905 A JP 2024509905A JP WO2023181831 A1 JPWO2023181831 A1 JP WO2023181831A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/66—Mercaptans
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022046977 | 2022-03-23 | ||
| PCT/JP2023/007785 WO2023181831A1 (ja) | 2022-03-23 | 2023-03-02 | 樹脂組成物、接着剤又は封止材、硬化物、半導体装置及び電子部品 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2023181831A1 true JPWO2023181831A1 (enrdf_load_stackoverflow) | 2023-09-28 |
Family
ID=88100692
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024509905A Pending JPWO2023181831A1 (enrdf_load_stackoverflow) | 2022-03-23 | 2023-03-02 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2023181831A1 (enrdf_load_stackoverflow) |
| TW (1) | TW202344552A (enrdf_load_stackoverflow) |
| WO (1) | WO2023181831A1 (enrdf_load_stackoverflow) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| MY179663A (en) * | 2014-09-11 | 2020-11-11 | Teijin Ltd | Thermosetting resin composition |
| CN104774584A (zh) * | 2014-12-29 | 2015-07-15 | 北京海斯迪克新材料有限公司 | 一种用于led背光模组lens粘接的单组份环氧胶粘剂 |
| JP6766360B2 (ja) * | 2016-01-15 | 2020-10-14 | 住友ベークライト株式会社 | 樹脂組成物 |
| JP7358988B2 (ja) * | 2018-01-15 | 2023-10-12 | 株式会社レゾナック | 液状封止樹脂組成物、電子部品装置及び電子部品装置の製造方法 |
| JP7014998B2 (ja) * | 2018-01-18 | 2022-02-02 | 味の素株式会社 | 樹脂組成物 |
| CN109536098A (zh) * | 2018-11-09 | 2019-03-29 | 苏州昇攀新材料技术有限公司 | 一种用于led背光模组的环氧胶黏剂及其制备方法 |
| JP2020132646A (ja) * | 2019-02-12 | 2020-08-31 | 住友ベークライト株式会社 | 樹脂組成物、それを用いたキャリア付樹脂膜、プリプレグ、積層板、プリント配線基板および半導体装置 |
| JP7437695B2 (ja) * | 2020-07-30 | 2024-02-26 | パナソニックＩｐマネジメント株式会社 | 熱硬化性組成物、硬化物、機器、及び機器の製造方法 |
| JPWO2023276773A1 (enrdf_load_stackoverflow) * | 2021-06-28 | 2023-01-05 | ||
| JP7649038B2 (ja) * | 2021-08-24 | 2025-03-19 | ナミックス株式会社 | 樹脂組成物及び接着剤 |
-
2023
- 2023-03-02 JP JP2024509905A patent/JPWO2023181831A1/ja active Pending
- 2023-03-02 TW TW112107642A patent/TW202344552A/zh unknown
- 2023-03-02 WO PCT/JP2023/007785 patent/WO2023181831A1/ja active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| TW202344552A (zh) | 2023-11-16 |
| WO2023181831A1 (ja) | 2023-09-28 |