JPWO2023176676A5 - - Google Patents

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Publication number
JPWO2023176676A5
JPWO2023176676A5 JP2024507829A JP2024507829A JPWO2023176676A5 JP WO2023176676 A5 JPWO2023176676 A5 JP WO2023176676A5 JP 2024507829 A JP2024507829 A JP 2024507829A JP 2024507829 A JP2024507829 A JP 2024507829A JP WO2023176676 A5 JPWO2023176676 A5 JP WO2023176676A5
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JP
Japan
Prior art keywords
silicon carbide
carbide epitaxial
main surface
epitaxial substrate
substrate according
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JP2024507829A
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English (en)
Japanese (ja)
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JPWO2023176676A1 (https=
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Priority claimed from PCT/JP2023/009018 external-priority patent/WO2023176676A1/ja
Publication of JPWO2023176676A1 publication Critical patent/JPWO2023176676A1/ja
Publication of JPWO2023176676A5 publication Critical patent/JPWO2023176676A5/ja
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JP2024507829A 2022-03-17 2023-03-09 Pending JPWO2023176676A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022042485 2022-03-17
PCT/JP2023/009018 WO2023176676A1 (ja) 2022-03-17 2023-03-09 炭化珪素エピタキシャル基板および炭化珪素半導体装置の製造方法

Publications (2)

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JPWO2023176676A1 JPWO2023176676A1 (https=) 2023-09-21
JPWO2023176676A5 true JPWO2023176676A5 (https=) 2024-11-22

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ID=88023273

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JP2024507829A Pending JPWO2023176676A1 (https=) 2022-03-17 2023-03-09

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US (1) US20250218771A1 (https=)
JP (1) JPWO2023176676A1 (https=)
WO (1) WO2023176676A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12590385B2 (en) 2023-11-07 2026-03-31 Resonac Corporation SiC epitaxial wafer
CN119967882A (zh) * 2023-11-07 2025-05-09 株式会社力森诺科 SiC外延晶片

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5961357B2 (ja) * 2011-09-09 2016-08-02 昭和電工株式会社 SiCエピタキシャルウェハ及びその製造方法
WO2015097852A1 (ja) * 2013-12-27 2015-07-02 日新電機株式会社 単結晶SiCエピタキシャル膜の形成方法
JP7517049B2 (ja) * 2020-01-24 2024-07-17 住友電気工業株式会社 炭化珪素基板の欠陥評価方法および炭化珪素基板の製造方法

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