JPWO2023153240A1 - - Google Patents

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Publication number
JPWO2023153240A1
JPWO2023153240A1 JP2023555676A JP2023555676A JPWO2023153240A1 JP WO2023153240 A1 JPWO2023153240 A1 JP WO2023153240A1 JP 2023555676 A JP2023555676 A JP 2023555676A JP 2023555676 A JP2023555676 A JP 2023555676A JP WO2023153240 A1 JPWO2023153240 A1 JP WO2023153240A1
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JP
Japan
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Pending
Application number
JP2023555676A
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JPWO2023153240A5 (ja
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Publication of JPWO2023153240A1 publication Critical patent/JPWO2023153240A1/ja
Publication of JPWO2023153240A5 publication Critical patent/JPWO2023153240A5/ja
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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    • H01L2924/1432Central processing unit [CPU]

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2023555676A 2022-02-09 2023-01-27 Pending JPWO2023153240A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022018785 2022-02-09
PCT/JP2023/002631 WO2023153240A1 (ja) 2022-02-09 2023-01-27 複合部品

Publications (2)

Publication Number Publication Date
JPWO2023153240A1 true JPWO2023153240A1 (ja) 2023-08-17
JPWO2023153240A5 JPWO2023153240A5 (ja) 2024-01-17

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