JPWO2023153240A1 - - Google Patents
Info
- Publication number
- JPWO2023153240A1 JPWO2023153240A1 JP2023555676A JP2023555676A JPWO2023153240A1 JP WO2023153240 A1 JPWO2023153240 A1 JP WO2023153240A1 JP 2023555676 A JP2023555676 A JP 2023555676A JP 2023555676 A JP2023555676 A JP 2023555676A JP WO2023153240 A1 JPWO2023153240 A1 JP WO2023153240A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H01—ELECTRIC ELEMENTS
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2022018785 | 2022-02-09 | ||
PCT/JP2023/002631 WO2023153240A1 (ja) | 2022-02-09 | 2023-01-27 | 複合部品 |
Publications (2)
Publication Number | Publication Date |
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JPWO2023153240A1 true JPWO2023153240A1 (ja) | 2023-08-17 |
JPWO2023153240A5 JPWO2023153240A5 (ja) | 2024-01-17 |
Family
ID=87564171
Family Applications (1)
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US9508674B2 (en) * | 2012-11-14 | 2016-11-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Warpage control of semiconductor die package |
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