JPWO2023149131A1 - - Google Patents
Info
- Publication number
- JPWO2023149131A1 JPWO2023149131A1 JP2023578422A JP2023578422A JPWO2023149131A1 JP WO2023149131 A1 JPWO2023149131 A1 JP WO2023149131A1 JP 2023578422 A JP2023578422 A JP 2023578422A JP 2023578422 A JP2023578422 A JP 2023578422A JP WO2023149131 A1 JPWO2023149131 A1 JP WO2023149131A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Junction Field-Effect Transistors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2022015237 | 2022-02-02 | ||
PCT/JP2022/047790 WO2023149131A1 (ja) | 2022-02-02 | 2022-12-23 | 半導体装置および半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2023149131A1 true JPWO2023149131A1 (ja) | 2023-08-10 |
JPWO2023149131A5 JPWO2023149131A5 (ja) | 2024-04-24 |
Family
ID=87552268
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023578422A Pending JPWO2023149131A1 (ja) | 2022-02-02 | 2022-12-23 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2023149131A1 (ja) |
CN (1) | CN117716514A (ja) |
WO (1) | WO2023149131A1 (ja) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6115678B1 (ja) * | 2016-02-01 | 2017-04-19 | 富士電機株式会社 | 炭化珪素半導体装置および炭化珪素半導体装置の製造方法 |
DE102018123164B3 (de) * | 2018-09-20 | 2020-01-23 | Infineon Technologies Ag | Halbleitervorrichtung, die eine graben-gatestruktur enthält, und herstellungsverfahren |
JP7290028B2 (ja) * | 2019-01-21 | 2023-06-13 | 富士電機株式会社 | 半導体装置および半導体装置の製造方法 |
JP2020205295A (ja) * | 2019-06-14 | 2020-12-24 | 国立研究開発法人産業技術総合研究所 | 炭化珪素半導体装置 |
-
2022
- 2022-12-23 JP JP2023578422A patent/JPWO2023149131A1/ja active Pending
- 2022-12-23 CN CN202280051873.8A patent/CN117716514A/zh active Pending
- 2022-12-23 WO PCT/JP2022/047790 patent/WO2023149131A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
CN117716514A (zh) | 2024-03-15 |
WO2023149131A1 (ja) | 2023-08-10 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A524 | Written submission of copy of amendment under article 19 pct |
Free format text: JAPANESE INTERMEDIATE CODE: A527 Effective date: 20240130 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240130 |