JPWO2023090351A1 - - Google Patents
Info
- Publication number
- JPWO2023090351A1 JPWO2023090351A1 JP2023562371A JP2023562371A JPWO2023090351A1 JP WO2023090351 A1 JPWO2023090351 A1 JP WO2023090351A1 JP 2023562371 A JP2023562371 A JP 2023562371A JP 2023562371 A JP2023562371 A JP 2023562371A JP WO2023090351 A1 JPWO2023090351 A1 JP WO2023090351A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Reinforced Plastic Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021188070 | 2021-11-18 | ||
| PCT/JP2022/042516 WO2023090351A1 (ja) | 2021-11-18 | 2022-11-16 | 樹脂組成物、プリプレグ、積層板、樹脂フィルム、プリント配線板及び半導体パッケージ |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2023090351A1 true JPWO2023090351A1 (https=) | 2023-05-25 |
Family
ID=86397039
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023562371A Pending JPWO2023090351A1 (https=) | 2021-11-18 | 2022-11-16 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2023090351A1 (https=) |
| TW (1) | TW202330781A (https=) |
| WO (1) | WO2023090351A1 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI876248B (zh) * | 2022-12-23 | 2025-03-11 | 南亞塑膠工業股份有限公司 | 樹脂組成物 |
| JPWO2025126952A1 (https=) * | 2023-12-12 | 2025-06-19 | ||
| CN121195027A (zh) * | 2023-12-28 | 2025-12-23 | 株式会社力森诺科 | 树脂组合物、树脂膜、预浸料、层叠板、印刷线路板及半导体封装体 |
| WO2025258485A1 (ja) * | 2024-06-11 | 2025-12-18 | 日本ゼオン株式会社 | 樹脂組成物、プリプレグ、積層体、金属張積層板および配線板 |
| WO2026063464A1 (ja) * | 2024-09-19 | 2026-03-26 | 株式会社レゾナック | 樹脂組成物、樹脂フィルム、プリプレグ、積層板、プリント配線板及び半導体パッケージ |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02120351A (ja) * | 1988-10-29 | 1990-05-08 | Japan Synthetic Rubber Co Ltd | 難燃性樹脂組成物 |
| CN104725828B (zh) * | 2015-03-04 | 2017-11-21 | 广东生益科技股份有限公司 | 一种树脂组合物以及使用它的预浸料和层压板 |
| JP7051333B2 (ja) * | 2017-08-25 | 2022-04-11 | 日鉄ケミカル＆マテリアル株式会社 | 硬化性樹脂組成物、その硬化物、硬化性複合材料、樹脂付き金属箔、及び回路基板材料用ワニス |
| JP7298623B2 (ja) * | 2018-11-08 | 2023-06-27 | 株式会社レゾナック | 樹脂組成物、樹脂組成物の硬化物、プリプレグ、積層板、樹脂フィルム、多層プリント配線板、ミリ波レーダー用多層プリント配線板及びポリフェニレンエーテル誘導体 |
| JP2020169276A (ja) * | 2019-04-03 | 2020-10-15 | 日立化成株式会社 | 樹脂組成物、プリプレグ、積層板、多層プリント配線板及び半導体パッケージ |
| JP7272068B2 (ja) * | 2019-04-03 | 2023-05-12 | 株式会社レゾナック | 樹脂組成物、プリプレグ、積層板、多層プリント配線板及び半導体パッケージ |
| JP7552037B2 (ja) * | 2020-03-05 | 2024-09-18 | 株式会社レゾナック | 樹脂組成物、プリプレグ、積層板、樹脂フィルム、プリント配線板、半導体パッケージ及び樹脂組成物の製造方法 |
| JP7508244B2 (ja) * | 2020-03-18 | 2024-07-01 | 旭化成株式会社 | ポリフェニレンエーテル樹脂組成物 |
| JP7631673B2 (ja) * | 2020-05-07 | 2025-02-19 | 株式会社レゾナック | 樹脂組成物、プリプレグ、積層板、樹脂フィルム、多層プリント配線板及び半導体パッケージ |
| JP2021080459A (ja) * | 2021-01-26 | 2021-05-27 | 昭和電工マテリアルズ株式会社 | 樹脂組成物、プリプレグ、積層板及び多層プリント配線板 |
-
2022
- 2022-11-16 JP JP2023562371A patent/JPWO2023090351A1/ja active Pending
- 2022-11-16 WO PCT/JP2022/042516 patent/WO2023090351A1/ja not_active Ceased
- 2022-11-17 TW TW111143922A patent/TW202330781A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202330781A (zh) | 2023-08-01 |
| WO2023090351A1 (ja) | 2023-05-25 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20251008 |