JPWO2023074633A5 - - Google Patents

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Publication number
JPWO2023074633A5
JPWO2023074633A5 JP2023556433A JP2023556433A JPWO2023074633A5 JP WO2023074633 A5 JPWO2023074633 A5 JP WO2023074633A5 JP 2023556433 A JP2023556433 A JP 2023556433A JP 2023556433 A JP2023556433 A JP 2023556433A JP WO2023074633 A5 JPWO2023074633 A5 JP WO2023074633A5
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JP
Japan
Prior art keywords
heat dissipation
dissipation member
particle size
size distribution
diamond particles
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JP2023556433A
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English (en)
Japanese (ja)
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JPWO2023074633A1 (cg-RX-API-DMAC7.html
JP7794844B2 (ja
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Priority claimed from PCT/JP2022/039554 external-priority patent/WO2023074633A1/ja
Publication of JPWO2023074633A1 publication Critical patent/JPWO2023074633A1/ja
Publication of JPWO2023074633A5 publication Critical patent/JPWO2023074633A5/ja
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Publication of JP7794844B2 publication Critical patent/JP7794844B2/ja
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JP2023556433A 2021-10-29 2022-10-24 放熱部材および電子装置 Active JP7794844B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021177306 2021-10-29
JP2021177306 2021-10-29
PCT/JP2022/039554 WO2023074633A1 (ja) 2021-10-29 2022-10-24 放熱部材および電子装置

Publications (3)

Publication Number Publication Date
JPWO2023074633A1 JPWO2023074633A1 (cg-RX-API-DMAC7.html) 2023-05-04
JPWO2023074633A5 true JPWO2023074633A5 (cg-RX-API-DMAC7.html) 2024-05-24
JP7794844B2 JP7794844B2 (ja) 2026-01-06

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ID=86157840

Family Applications (1)

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JP2023556433A Active JP7794844B2 (ja) 2021-10-29 2022-10-24 放熱部材および電子装置

Country Status (2)

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JP (1) JP7794844B2 (cg-RX-API-DMAC7.html)
WO (1) WO2023074633A1 (cg-RX-API-DMAC7.html)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4148123B2 (ja) * 2003-12-08 2008-09-10 三菱マテリアル株式会社 放熱体及びパワーモジュール
WO2007074720A1 (ja) * 2005-12-28 2007-07-05 A. L. M. T. Corp. 半導体素子実装用基板とそれを用いた半導体装置および半導体素子実装用基板の製造方法
JP2013098491A (ja) * 2011-11-04 2013-05-20 Sumitomo Electric Ind Ltd ヒートシンク、ヒートシンクを作製する方法、半導体装置、半導体モジュール
JP6429108B2 (ja) * 2013-10-16 2018-11-28 株式会社アライドマテリアル 半導体素子実装用基板とそれを用いた半導体素子装置
CN111727266B (zh) * 2018-02-14 2021-11-02 住友电气工业株式会社 复合部件以及复合部件的制造方法
JP7602118B2 (ja) * 2020-01-31 2024-12-18 日亜化学工業株式会社 放熱基板の製造方法及び複合基板の製造方法

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