JPWO2023067700A1 - - Google Patents
Info
- Publication number
- JPWO2023067700A1 JPWO2023067700A1 JP2023554131A JP2023554131A JPWO2023067700A1 JP WO2023067700 A1 JPWO2023067700 A1 JP WO2023067700A1 JP 2023554131 A JP2023554131 A JP 2023554131A JP 2023554131 A JP2023554131 A JP 2023554131A JP WO2023067700 A1 JPWO2023067700 A1 JP WO2023067700A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2021/038637 WO2023067700A1 (ja) | 2021-10-19 | 2021-10-19 | 基板のクランプ方法、作業装置及び作業システム |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2023067700A1 true JPWO2023067700A1 (zh) | 2023-04-27 |
Family
ID=86058916
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023554131A Pending JPWO2023067700A1 (zh) | 2021-10-19 | 2021-10-19 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPWO2023067700A1 (zh) |
WO (1) | WO2023067700A1 (zh) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4835573B2 (ja) * | 2007-10-26 | 2011-12-14 | パナソニック株式会社 | 基板搬送装置および基板搬送方法 |
JP6602584B2 (ja) * | 2015-07-24 | 2019-11-06 | 株式会社Fuji | 部品実装機 |
WO2018109891A1 (ja) * | 2016-12-15 | 2018-06-21 | 株式会社Fuji | 基板搬送装置 |
JP7300575B2 (ja) * | 2018-10-15 | 2023-06-30 | パナソニックIpマネジメント株式会社 | 部品装着装置および実装基板の製造方法 |
JP7220308B2 (ja) * | 2020-01-31 | 2023-02-09 | 株式会社Fuji | 対基板作業機 |
-
2021
- 2021-10-19 JP JP2023554131A patent/JPWO2023067700A1/ja active Pending
- 2021-10-19 WO PCT/JP2021/038637 patent/WO2023067700A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2023067700A1 (ja) | 2023-04-27 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240827 |