JPWO2021152840A1 - - Google Patents

Info

Publication number
JPWO2021152840A1
JPWO2021152840A1 JP2021574417A JP2021574417A JPWO2021152840A1 JP WO2021152840 A1 JPWO2021152840 A1 JP WO2021152840A1 JP 2021574417 A JP2021574417 A JP 2021574417A JP 2021574417 A JP2021574417 A JP 2021574417A JP WO2021152840 A1 JPWO2021152840 A1 JP WO2021152840A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021574417A
Other languages
Japanese (ja)
Other versions
JP7220308B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021152840A1 publication Critical patent/JPWO2021152840A1/ja
Application granted granted Critical
Publication of JP7220308B2 publication Critical patent/JP7220308B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2021574417A 2020-01-31 2020-01-31 対基板作業機 Active JP7220308B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/003751 WO2021152840A1 (ja) 2020-01-31 2020-01-31 対基板作業機

Publications (2)

Publication Number Publication Date
JPWO2021152840A1 true JPWO2021152840A1 (zh) 2021-08-05
JP7220308B2 JP7220308B2 (ja) 2023-02-09

Family

ID=77079768

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021574417A Active JP7220308B2 (ja) 2020-01-31 2020-01-31 対基板作業機

Country Status (2)

Country Link
JP (1) JP7220308B2 (zh)
WO (1) WO2021152840A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023067700A1 (ja) * 2021-10-19 2023-04-27 株式会社Fuji 基板のクランプ方法、作業装置及び作業システム
WO2024009506A1 (ja) * 2022-07-08 2024-01-11 株式会社Fuji 対基板作業装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002517104A (ja) * 1998-05-28 2002-06-11 シーメンス アクチエンゲゼルシヤフト 基板を直線的に位置決めしかつその位置を認識するための方法及び装置
WO2003088730A1 (fr) * 2002-04-01 2003-10-23 Fuji Machine Mfg. Co., Ltd. Systeme de travail de substrat
JP2010161262A (ja) * 2009-01-09 2010-07-22 Fuji Mach Mfg Co Ltd 部品実装基板生産方法及び部品実装基板生産システム
JP2013206912A (ja) * 2012-03-27 2013-10-07 Sony Corp 部品実装装置、基板検出方法及び基板製造方法
JP2018200937A (ja) * 2017-05-26 2018-12-20 株式会社Ｆｕｊｉ 対基板作業装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002517104A (ja) * 1998-05-28 2002-06-11 シーメンス アクチエンゲゼルシヤフト 基板を直線的に位置決めしかつその位置を認識するための方法及び装置
WO2003088730A1 (fr) * 2002-04-01 2003-10-23 Fuji Machine Mfg. Co., Ltd. Systeme de travail de substrat
JP2010161262A (ja) * 2009-01-09 2010-07-22 Fuji Mach Mfg Co Ltd 部品実装基板生産方法及び部品実装基板生産システム
JP2013206912A (ja) * 2012-03-27 2013-10-07 Sony Corp 部品実装装置、基板検出方法及び基板製造方法
JP2018200937A (ja) * 2017-05-26 2018-12-20 株式会社Ｆｕｊｉ 対基板作業装置

Also Published As

Publication number Publication date
JP7220308B2 (ja) 2023-02-09
WO2021152840A1 (ja) 2021-08-05

Similar Documents

Publication Publication Date Title
BR112023005462A2 (zh)
BR112023012656A2 (zh)
BR112021014123A2 (zh)
BR112022024743A2 (zh)
BR102021018859A2 (zh)
BR102021015500A2 (zh)
BR112022009896A2 (zh)
BR102021007058A2 (zh)
JPWO2022219744A1 (zh)
BR102020022030A2 (zh)
BR112023011738A2 (zh)
BR112023016292A2 (zh)
BR112023004146A2 (zh)
BR112023011610A2 (zh)
BR112023011539A2 (zh)
BR112023008976A2 (zh)
BR112023006729A2 (zh)
BR102021020147A2 (zh)
BR102021018926A2 (zh)
BR102021018167A2 (zh)
BR102021017576A2 (zh)
BR102021016837A2 (zh)
BR102021016551A2 (zh)
BR102021016375A2 (zh)
BR102021016200A2 (zh)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20220311

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20221108

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20221221

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20230117

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20230130

R150 Certificate of patent or registration of utility model

Ref document number: 7220308

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150