JPWO2023058126A1 - - Google Patents
Info
- Publication number
- JPWO2023058126A1 JPWO2023058126A1 JP2023552449A JP2023552449A JPWO2023058126A1 JP WO2023058126 A1 JPWO2023058126 A1 JP WO2023058126A1 JP 2023552449 A JP2023552449 A JP 2023552449A JP 2023552449 A JP2023552449 A JP 2023552449A JP WO2023058126 A1 JPWO2023058126 A1 JP WO2023058126A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2021/036864 WO2023058126A1 (ja) | 2021-10-05 | 2021-10-05 | 基板の製造方法および半導体装置の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2023058126A1 true JPWO2023058126A1 (ja) | 2023-04-13 |
Family
ID=85804053
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023552449A Pending JPWO2023058126A1 (ja) | 2021-10-05 | 2021-10-05 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPWO2023058126A1 (ja) |
WO (1) | WO2023058126A1 (ja) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05149989A (ja) * | 1991-11-28 | 1993-06-15 | Hitachi Chem Co Ltd | プリント配線板の試験方法 |
JPH0763721A (ja) * | 1993-08-26 | 1995-03-10 | Babcock Hitachi Kk | 金属材料の腐食予測方法及びその装置 |
JPH07249845A (ja) * | 1994-03-10 | 1995-09-26 | Toshiba Corp | プリント基板の寿命予測方法 |
JPH08262094A (ja) * | 1995-03-17 | 1996-10-11 | Toa Denpa Kogyo Kk | 電気的試験用電極 |
JP3340317B2 (ja) * | 1995-08-24 | 2002-11-05 | 松下電器産業株式会社 | 金属の表面状態評価方法及び半導体装置の製造方法 |
WO2007132721A1 (ja) * | 2006-05-15 | 2007-11-22 | Alps Electric Co., Ltd. | 電子部品及びその製造方法 |
JP4844243B2 (ja) * | 2006-06-06 | 2011-12-28 | 富士通株式会社 | 絶縁材料の金属腐蝕性試験方法 |
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2021
- 2021-10-05 WO PCT/JP2021/036864 patent/WO2023058126A1/ja active Application Filing
- 2021-10-05 JP JP2023552449A patent/JPWO2023058126A1/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2023058126A1 (ja) | 2023-04-13 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230922 |