JPWO2023054561A5 - - Google Patents
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- Publication number
- JPWO2023054561A5 JPWO2023054561A5 JP2022562874A JP2022562874A JPWO2023054561A5 JP WO2023054561 A5 JPWO2023054561 A5 JP WO2023054561A5 JP 2022562874 A JP2022562874 A JP 2022562874A JP 2022562874 A JP2022562874 A JP 2022562874A JP WO2023054561 A5 JPWO2023054561 A5 JP WO2023054561A5
- Authority
- JP
- Japan
- Prior art keywords
- curable resin
- resin composition
- composition according
- cationically polymerizable
- polysilsesquioxane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021161360 | 2021-09-30 | ||
| PCT/JP2022/036375 WO2023054561A1 (ja) | 2021-09-30 | 2022-09-29 | 硬化性樹脂組成物、コーティング層、及び、フィルム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023054561A1 JPWO2023054561A1 (https=) | 2023-04-06 |
| JPWO2023054561A5 true JPWO2023054561A5 (https=) | 2024-06-19 |
Family
ID=85782877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022562874A Withdrawn JPWO2023054561A1 (https=) | 2021-09-30 | 2022-09-29 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2023054561A1 (https=) |
| TW (1) | TW202323461A (https=) |
| WO (1) | WO2023054561A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2133063A1 (en) * | 2008-06-10 | 2009-12-16 | 3M Innovative Properties Company | Initiator system with biphenylene derivates, method of production and use thereof |
| WO2016204115A1 (ja) * | 2015-06-17 | 2016-12-22 | 株式会社ダイセル | 硬化物の製造方法、硬化物、及び前記硬化物を含む積層物 |
| JP6795498B2 (ja) * | 2015-06-17 | 2020-12-02 | 株式会社ダイセル | 硬化性組成物、及び成形体 |
| US20190185711A1 (en) * | 2016-08-26 | 2019-06-20 | Jnc Corporation | Epoxy resin composition and cured resin film with low curing shrinkage and excellent adhesion |
| JP2018177951A (ja) * | 2017-04-12 | 2018-11-15 | 株式会社ダイセル | 硬化性組成物、硬化物及びハードコートフィルム |
| JP2018177952A (ja) * | 2017-04-12 | 2018-11-15 | 株式会社ダイセル | 硬化性組成物、硬化物及びハードコートフィルム |
-
2022
- 2022-09-29 JP JP2022562874A patent/JPWO2023054561A1/ja not_active Withdrawn
- 2022-09-29 WO PCT/JP2022/036375 patent/WO2023054561A1/ja not_active Ceased
- 2022-09-30 TW TW111137235A patent/TW202323461A/zh unknown
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