JPWO2023054137A1 - - Google Patents

Info

Publication number
JPWO2023054137A1
JPWO2023054137A1 JP2023551394A JP2023551394A JPWO2023054137A1 JP WO2023054137 A1 JPWO2023054137 A1 JP WO2023054137A1 JP 2023551394 A JP2023551394 A JP 2023551394A JP 2023551394 A JP2023551394 A JP 2023551394A JP WO2023054137 A1 JPWO2023054137 A1 JP WO2023054137A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023551394A
Other versions
JPWO2023054137A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023054137A1 publication Critical patent/JPWO2023054137A1/ja
Publication of JPWO2023054137A5 publication Critical patent/JPWO2023054137A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2023551394A 2021-09-29 2022-09-21 Pending JPWO2023054137A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021159610 2021-09-29
PCT/JP2022/035265 WO2023054137A1 (ja) 2021-09-29 2022-09-21 配線基板

Publications (2)

Publication Number Publication Date
JPWO2023054137A1 true JPWO2023054137A1 (ja) 2023-04-06
JPWO2023054137A5 JPWO2023054137A5 (ja) 2024-05-30

Family

ID=85780678

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023551394A Pending JPWO2023054137A1 (ja) 2021-09-29 2022-09-21

Country Status (3)

Country Link
JP (1) JPWO2023054137A1 (ja)
CN (1) CN118020391A (ja)
WO (1) WO2023054137A1 (ja)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003277852A (ja) 2002-03-25 2003-10-02 Kyocera Corp 銅メタライズ組成物およびセラミック配線基板
JP4807161B2 (ja) * 2006-06-29 2011-11-02 株式会社村田製作所 積層型セラミック電子部品およびその製造方法
JP4781189B2 (ja) * 2006-07-27 2011-09-28 京セラ株式会社 配線基板
KR100997989B1 (ko) * 2008-08-28 2010-12-03 삼성전기주식회사 다층 세라믹 기판
WO2016167355A1 (ja) * 2015-04-17 2016-10-20 株式会社村田製作所 セラミック配線基板およびセラミック配線基板の製造方法

Also Published As

Publication number Publication date
CN118020391A (zh) 2024-05-10
WO2023054137A1 (ja) 2023-04-06

Similar Documents

Publication Publication Date Title
BR112021014123A2 (ja)
BR102021018859A2 (ja)
BR102021015500A2 (ja)
BR102021007058A2 (ja)
BR102020022030A2 (ja)
JPWO2023054137A1 (ja)
BR102021020147A2 (ja)
BR102021018926A2 (ja)
BR102021018167A2 (ja)
BR102021017576A2 (ja)
BR102021016837A2 (ja)
BR102021016551A2 (ja)
BR102021016375A2 (ja)
BR102021016200A2 (ja)
BR102021016176A2 (ja)
BR102021015566A2 (ja)
BR102021015450A8 (ja)
BR102021015220A2 (ja)
BR102021015247A2 (ja)
BR102021014056A2 (ja)
BR102021014044A2 (ja)
BR102021013929A2 (ja)
BR102021012571A2 (ja)
BR102021012230A2 (ja)
BR102021012003A2 (ja)

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240307

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240307