JPWO2023042736A1 - - Google Patents

Info

Publication number
JPWO2023042736A1
JPWO2023042736A1 JP2023548436A JP2023548436A JPWO2023042736A1 JP WO2023042736 A1 JPWO2023042736 A1 JP WO2023042736A1 JP 2023548436 A JP2023548436 A JP 2023548436A JP 2023548436 A JP2023548436 A JP 2023548436A JP WO2023042736 A1 JPWO2023042736 A1 JP WO2023042736A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023548436A
Other languages
Japanese (ja)
Other versions
JPWO2023042736A5 (cg-RX-API-DMAC7.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023042736A1 publication Critical patent/JPWO2023042736A1/ja
Publication of JPWO2023042736A5 publication Critical patent/JPWO2023042736A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/04—Drying solid materials or objects by processes not involving the application of heat by evaporation or sublimation of moisture under reduced pressure, e.g. in a vacuum
    • F26B5/041—Drying solid materials or objects by processes not involving the application of heat by evaporation or sublimation of moisture under reduced pressure, e.g. in a vacuum for drying flowable materials, e.g. suspensions, bulk goods, in a continuous operation, e.g. with locks or other air tight arrangements for charging/discharging

Landscapes

  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Molecular Biology (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
JP2023548436A 2021-09-15 2022-09-08 Pending JPWO2023042736A1 (cg-RX-API-DMAC7.html)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021150186 2021-09-15
PCT/JP2022/033662 WO2023042736A1 (ja) 2021-09-15 2022-09-08 基板の製造方法および昇華乾燥方法

Publications (2)

Publication Number Publication Date
JPWO2023042736A1 true JPWO2023042736A1 (cg-RX-API-DMAC7.html) 2023-03-23
JPWO2023042736A5 JPWO2023042736A5 (cg-RX-API-DMAC7.html) 2024-06-05

Family

ID=85602156

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023548436A Pending JPWO2023042736A1 (cg-RX-API-DMAC7.html) 2021-09-15 2022-09-08

Country Status (7)

Country Link
US (1) US20240371627A1 (cg-RX-API-DMAC7.html)
EP (1) EP4404243A4 (cg-RX-API-DMAC7.html)
JP (1) JPWO2023042736A1 (cg-RX-API-DMAC7.html)
KR (1) KR20240067920A (cg-RX-API-DMAC7.html)
IL (1) IL311467A (cg-RX-API-DMAC7.html)
TW (1) TW202332994A (cg-RX-API-DMAC7.html)
WO (1) WO2023042736A1 (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025125474A (ja) * 2024-02-15 2025-08-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法、基板処理装置及び基板処理液

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012243869A (ja) * 2011-05-17 2012-12-10 Tokyo Electron Ltd 基板乾燥方法及び基板処理装置
JP2020136355A (ja) * 2019-02-14 2020-08-31 株式会社Ｓｃｒｅｅｎホールディングス 基板乾燥方法および基板処理装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6022829B2 (ja) * 2012-07-03 2016-11-09 株式会社Ｓｃｒｅｅｎホールディングス 基板乾燥方法および基板乾燥装置
JP6592303B2 (ja) * 2015-08-14 2019-10-16 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄方法および基板洗浄装置
KR102741585B1 (ko) * 2019-03-19 2024-12-12 샌트랄 글래스 컴퍼니 리미티드 요철 패턴 건조용 조성물, 및 표면에 요철 패턴을 가지는 기판의 제조 방법
JP2021150186A (ja) 2020-03-19 2021-09-27 東芝ライテック株式会社 推定装置、推定システム、推定方法および推定プログラム

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012243869A (ja) * 2011-05-17 2012-12-10 Tokyo Electron Ltd 基板乾燥方法及び基板処理装置
JP2020136355A (ja) * 2019-02-14 2020-08-31 株式会社Ｓｃｒｅｅｎホールディングス 基板乾燥方法および基板処理装置

Also Published As

Publication number Publication date
US20240371627A1 (en) 2024-11-07
KR20240067920A (ko) 2024-05-17
EP4404243A4 (en) 2025-09-24
IL311467A (en) 2024-05-01
EP4404243A1 (en) 2024-07-24
TW202332994A (zh) 2023-08-16
WO2023042736A1 (ja) 2023-03-23

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