JPWO2023037748A1 - - Google Patents

Info

Publication number
JPWO2023037748A1
JPWO2023037748A1 JP2023546804A JP2023546804A JPWO2023037748A1 JP WO2023037748 A1 JPWO2023037748 A1 JP WO2023037748A1 JP 2023546804 A JP2023546804 A JP 2023546804A JP 2023546804 A JP2023546804 A JP 2023546804A JP WO2023037748 A1 JPWO2023037748 A1 JP WO2023037748A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023546804A
Other languages
Japanese (ja)
Other versions
JPWO2023037748A5 (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023037748A1 publication Critical patent/JPWO2023037748A1/ja
Publication of JPWO2023037748A5 publication Critical patent/JPWO2023037748A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemically Coating (AREA)
JP2023546804A 2021-09-08 2022-07-07 Pending JPWO2023037748A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021146116 2021-09-08
PCT/JP2022/026971 WO2023037748A1 (ja) 2021-09-08 2022-07-07 基板

Publications (2)

Publication Number Publication Date
JPWO2023037748A1 true JPWO2023037748A1 (zh) 2023-03-16
JPWO2023037748A5 JPWO2023037748A5 (zh) 2024-05-22

Family

ID=85506440

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023546804A Pending JPWO2023037748A1 (zh) 2021-09-08 2022-07-07

Country Status (3)

Country Link
JP (1) JPWO2023037748A1 (zh)
CN (1) CN117940606A (zh)
WO (1) WO2023037748A1 (zh)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007123674A (ja) * 2005-10-31 2007-05-17 Murata Mfg Co Ltd 配線基板、及び電子装置
JP5019596B2 (ja) * 2007-06-29 2012-09-05 古河電気工業株式会社 プリント配線板及びプリント回路板
JP2010103377A (ja) * 2008-10-24 2010-05-06 Nippon Steel Materials Co Ltd はんだバンプを有する電子部材

Also Published As

Publication number Publication date
WO2023037748A1 (ja) 2023-03-16
CN117940606A (zh) 2024-04-26

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Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240227

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240227