JPWO2023037410A1 - - Google Patents

Info

Publication number
JPWO2023037410A1
JPWO2023037410A1 JP2023546594A JP2023546594A JPWO2023037410A1 JP WO2023037410 A1 JPWO2023037410 A1 JP WO2023037410A1 JP 2023546594 A JP2023546594 A JP 2023546594A JP 2023546594 A JP2023546594 A JP 2023546594A JP WO2023037410 A1 JPWO2023037410 A1 JP WO2023037410A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023546594A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023037410A1 publication Critical patent/JPWO2023037410A1/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/081Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/0002Inspection of images, e.g. flaw detection
    • G06T7/0004Industrial image inspection
    • G06T7/001Industrial image inspection using an image reference approach
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/30Subject of image; Context of image processing
    • G06T2207/30108Industrial image inspection
    • G06T2207/30141Printed circuit board [PCB]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP2023546594A 2021-09-07 2021-09-07 Pending JPWO2023037410A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/032842 WO2023037410A1 (en) 2021-09-07 2021-09-07 Component mounting system

Publications (1)

Publication Number Publication Date
JPWO2023037410A1 true JPWO2023037410A1 (en) 2023-03-16

Family

ID=82594513

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023546594A Pending JPWO2023037410A1 (en) 2021-09-07 2021-09-07

Country Status (5)

Country Link
JP (1) JPWO2023037410A1 (en)
KR (1) KR20240039039A (en)
CN (1) CN117882505A (en)
TW (1) TWI765839B (en)
WO (1) WO2023037410A1 (en)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1022693A (en) * 1996-07-04 1998-01-23 Matsushita Electric Ind Co Ltd Electronic component-installing device
JP4541172B2 (en) 2005-01-28 2010-09-08 ヤマハ発動機株式会社 Information management system in component mounting line
JP3818308B2 (en) * 2005-02-01 2006-09-06 オムロン株式会社 Printed circuit board quality control system
CN106405369A (en) * 2015-07-31 2017-02-15 精工爱普生株式会社 Electronic component transportation device and electronic component inspection device
WO2018087932A1 (en) * 2016-11-14 2018-05-17 株式会社Fuji Stored image reclassification system and re-classification method
CN111656883B (en) * 2018-02-09 2021-07-30 株式会社富士 Learning completion model generation system and method for component image recognition

Also Published As

Publication number Publication date
TW202312858A (en) 2023-03-16
KR20240039039A (en) 2024-03-26
WO2023037410A1 (en) 2023-03-16
TWI765839B (en) 2022-05-21
CN117882505A (en) 2024-04-12

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240209