JPWO2023032861A1 - - Google Patents

Info

Publication number
JPWO2023032861A1
JPWO2023032861A1 JP2023545533A JP2023545533A JPWO2023032861A1 JP WO2023032861 A1 JPWO2023032861 A1 JP WO2023032861A1 JP 2023545533 A JP2023545533 A JP 2023545533A JP 2023545533 A JP2023545533 A JP 2023545533A JP WO2023032861 A1 JPWO2023032861 A1 JP WO2023032861A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023545533A
Other languages
Japanese (ja)
Other versions
JPWO2023032861A5 (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023032861A1 publication Critical patent/JPWO2023032861A1/ja
Publication of JPWO2023032861A5 publication Critical patent/JPWO2023032861A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2023545533A 2021-08-30 2022-08-26 Pending JPWO2023032861A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021140408 2021-08-30
PCT/JP2022/032272 WO2023032861A1 (ja) 2021-08-30 2022-08-26 硬化性樹脂組成物及び電子部品装置

Publications (2)

Publication Number Publication Date
JPWO2023032861A1 true JPWO2023032861A1 (zh) 2023-03-09
JPWO2023032861A5 JPWO2023032861A5 (zh) 2024-05-23

Family

ID=85412725

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023545533A Pending JPWO2023032861A1 (zh) 2021-08-30 2022-08-26

Country Status (4)

Country Link
JP (1) JPWO2023032861A1 (zh)
CN (1) CN117858915A (zh)
TW (1) TW202309190A (zh)
WO (1) WO2023032861A1 (zh)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018104603A (ja) * 2016-12-27 2018-07-05 日立化成株式会社 硬化性樹脂組成物及び電子部品装置
JP7279333B2 (ja) * 2018-10-17 2023-05-23 株式会社レゾナック 硬化性樹脂組成物用添加剤、硬化性樹脂組成物及び電子部品装置

Also Published As

Publication number Publication date
TW202309190A (zh) 2023-03-01
WO2023032861A1 (ja) 2023-03-09
CN117858915A (zh) 2024-04-09

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Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240215