JPWO2023032073A1 - - Google Patents

Info

Publication number
JPWO2023032073A1
JPWO2023032073A1 JP2023544867A JP2023544867A JPWO2023032073A1 JP WO2023032073 A1 JPWO2023032073 A1 JP WO2023032073A1 JP 2023544867 A JP2023544867 A JP 2023544867A JP 2023544867 A JP2023544867 A JP 2023544867A JP WO2023032073 A1 JPWO2023032073 A1 JP WO2023032073A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023544867A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023032073A1 publication Critical patent/JPWO2023032073A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/0882—Control systems for mounting machines or assembly lines, e.g. centralized control, remote links, programming of apparatus and processes as such
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Automation & Control Theory (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Automatic Assembly (AREA)
JP2023544867A 2021-09-01 2021-09-01 Pending JPWO2023032073A1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/032112 WO2023032073A1 (ja) 2021-09-01 2021-09-01 実装装置、実装システム及び設定方法

Publications (1)

Publication Number Publication Date
JPWO2023032073A1 true JPWO2023032073A1 (ja) 2023-03-09

Family

ID=85410984

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023544867A Pending JPWO2023032073A1 (ja) 2021-09-01 2021-09-01

Country Status (5)

Country Link
US (1) US20240341072A1 (ja)
JP (1) JPWO2023032073A1 (ja)
CN (1) CN117837287A (ja)
DE (1) DE112021008161T5 (ja)
WO (1) WO2023032073A1 (ja)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05198977A (ja) * 1992-01-20 1993-08-06 Matsushita Electric Ind Co Ltd 電子部品実装機のノズル高さ補正方法
JP3545108B2 (ja) * 1995-09-13 2004-07-21 株式会社日立ハイテクインスツルメンツ 電子部品自動装着装置及び装着方法
JP4694733B2 (ja) * 2001-08-16 2011-06-08 富士機械製造株式会社 電気部品装着システム
JP4359290B2 (ja) 2006-03-15 2009-11-04 パナソニック株式会社 実装方法、実装プログラム、部品実装機
WO2013145228A1 (ja) * 2012-03-29 2013-10-03 富士機械製造株式会社 部品実装機
JP6076047B2 (ja) * 2012-11-12 2017-02-08 ヤマハ発動機株式会社 電子部品実装装置及び演算装置及び電子部品実装方法
JP6248286B2 (ja) * 2014-06-03 2017-12-20 パナソニックＩｐマネジメント株式会社 部品実装システムおよび部品実装用データ変更方法
JP2016187016A (ja) 2015-03-27 2016-10-27 株式会社村田製作所 電子部品の吸着搬送機構
US20170166407A1 (en) * 2015-12-15 2017-06-15 Intel Corporation Universal pick and place head for handling components of any shape

Also Published As

Publication number Publication date
CN117837287A (zh) 2024-04-05
US20240341072A1 (en) 2024-10-10
DE112021008161T5 (de) 2024-06-13
WO2023032073A1 (ja) 2023-03-09

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240709