JPWO2023027123A1 - - Google Patents

Info

Publication number
JPWO2023027123A1
JPWO2023027123A1 JP2023514475A JP2023514475A JPWO2023027123A1 JP WO2023027123 A1 JPWO2023027123 A1 JP WO2023027123A1 JP 2023514475 A JP2023514475 A JP 2023514475A JP 2023514475 A JP2023514475 A JP 2023514475A JP WO2023027123 A1 JPWO2023027123 A1 JP WO2023027123A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023514475A
Other languages
Japanese (ja)
Other versions
JP7263634B1 (ja
JPWO2023027123A5 (fr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023027123A1 publication Critical patent/JPWO2023027123A1/ja
Application granted granted Critical
Publication of JP7263634B1 publication Critical patent/JP7263634B1/ja
Publication of JPWO2023027123A5 publication Critical patent/JPWO2023027123A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/82—Coating or impregnation with organic materials
    • C04B41/83—Macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
JP2023514475A 2021-08-26 2022-08-24 複合シート、及び複合シートの製造方法、並びに、積層基板 Active JP7263634B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021138222 2021-08-26
JP2021138222 2021-08-26
PCT/JP2022/031929 WO2023027123A1 (fr) 2021-08-26 2022-08-24 Feuille composite et procédé de fabrication de feuille composite, et substrat stratifié

Publications (3)

Publication Number Publication Date
JPWO2023027123A1 true JPWO2023027123A1 (fr) 2023-03-02
JP7263634B1 JP7263634B1 (ja) 2023-04-24
JPWO2023027123A5 JPWO2023027123A5 (fr) 2023-08-02

Family

ID=85322879

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023514475A Active JP7263634B1 (ja) 2021-08-26 2022-08-24 複合シート、及び複合シートの製造方法、並びに、積層基板

Country Status (2)

Country Link
JP (1) JP7263634B1 (fr)
WO (1) WO2023027123A1 (fr)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6262522B2 (ja) * 2013-12-26 2018-01-17 デンカ株式会社 樹脂含浸窒化ホウ素焼結体およびその用途
JP6861697B2 (ja) * 2016-03-10 2021-04-21 デンカ株式会社 セラミックス樹脂複合体
JP6609073B1 (ja) * 2019-01-15 2019-11-20 株式会社日本マイクロニクス プローブ基板及び電気的接続装置
US20220194870A1 (en) * 2019-03-29 2022-06-23 Denka Company Limited Composite, method for producing composite, laminate, and method for producing laminate

Also Published As

Publication number Publication date
JP7263634B1 (ja) 2023-04-24
WO2023027123A1 (fr) 2023-03-02

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