JPWO2023026778A1 - - Google Patents
Info
- Publication number
- JPWO2023026778A1 JPWO2023026778A1 JP2023543767A JP2023543767A JPWO2023026778A1 JP WO2023026778 A1 JPWO2023026778 A1 JP WO2023026778A1 JP 2023543767 A JP2023543767 A JP 2023543767A JP 2023543767 A JP2023543767 A JP 2023543767A JP WO2023026778 A1 JPWO2023026778 A1 JP WO2023026778A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021136291 | 2021-08-24 | ||
PCT/JP2022/029476 WO2023026778A1 (ja) | 2021-08-24 | 2022-08-01 | 化学機械研磨用組成物および研磨方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2023026778A1 true JPWO2023026778A1 (ja) | 2023-03-02 |
Family
ID=85323075
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023543767A Pending JPWO2023026778A1 (ja) | 2021-08-24 | 2022-08-01 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2023026778A1 (ja) |
TW (1) | TW202310031A (ja) |
WO (1) | WO2023026778A1 (ja) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4846445B2 (ja) * | 2006-05-19 | 2011-12-28 | 新日本製鐵株式会社 | 炭化珪素単結晶ウェハ表面の仕上げ研磨方法 |
WO2016140246A1 (ja) * | 2015-03-04 | 2016-09-09 | 日立化成株式会社 | Cmp用研磨液、及び、これを用いた研磨方法 |
CN112920717A (zh) * | 2021-02-23 | 2021-06-08 | 中山荣拓智能装备有限公司 | 一种碳化硅单晶抛光液及其使用方法 |
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2022
- 2022-07-18 TW TW111126907A patent/TW202310031A/zh unknown
- 2022-08-01 JP JP2023543767A patent/JPWO2023026778A1/ja active Pending
- 2022-08-01 WO PCT/JP2022/029476 patent/WO2023026778A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2023026778A1 (ja) | 2023-03-02 |
TW202310031A (zh) | 2023-03-01 |