JPWO2023017752A1 - - Google Patents
Info
- Publication number
- JPWO2023017752A1 JPWO2023017752A1 JP2023541411A JP2023541411A JPWO2023017752A1 JP WO2023017752 A1 JPWO2023017752 A1 JP WO2023017752A1 JP 2023541411 A JP2023541411 A JP 2023541411A JP 2023541411 A JP2023541411 A JP 2023541411A JP WO2023017752 A1 JPWO2023017752 A1 JP WO2023017752A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
- C08G75/02—Polythioethers
- C08G75/04—Polythioethers from mercapto compounds or metallic derivatives thereof
- C08G75/045—Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D295/00—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms
- C07D295/04—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms
- C07D295/12—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms substituted by singly or doubly bound nitrogen atoms
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Medicinal Chemistry (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Polymers & Plastics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021130492 | 2021-08-10 | ||
JP2021132974 | 2021-08-17 | ||
PCT/JP2022/029484 WO2023017752A1 (ja) | 2021-08-10 | 2022-08-01 | 樹脂組成物及び接着剤 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2023017752A1 true JPWO2023017752A1 (ko) | 2023-02-16 |
Family
ID=85199974
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023541411A Pending JPWO2023017752A1 (ko) | 2021-08-10 | 2022-08-01 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPWO2023017752A1 (ko) |
KR (1) | KR20240040805A (ko) |
TW (1) | TW202313911A (ko) |
WO (1) | WO2023017752A1 (ko) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070096056A1 (en) | 2003-11-26 | 2007-05-03 | Mitsui Chemicals, Inc. | One component resin composition curable with combination of light and heat and use of the same |
JP2009051954A (ja) | 2007-08-28 | 2009-03-12 | Three Bond Co Ltd | 光および加熱硬化性組成物とその硬化物 |
JP4976575B1 (ja) | 2011-07-07 | 2012-07-18 | ナミックス株式会社 | 樹脂組成物 |
JP2016117832A (ja) * | 2014-12-22 | 2016-06-30 | 昭和電工株式会社 | 光硬化性組成物およびその用途 |
KR102197489B1 (ko) * | 2016-06-22 | 2020-12-31 | 후지필름 가부시키가이샤 | 경화성 조성물, 경화막, 컬러 필터, 차광막, 고체 촬상 소자, 화상 표시 장치, 경화막의 제조 방법, 및 다관능 싸이올 화합물 |
WO2020080391A1 (ja) * | 2018-10-17 | 2020-04-23 | ナミックス株式会社 | 樹脂組成物 |
-
2022
- 2022-08-01 TW TW111128802A patent/TW202313911A/zh unknown
- 2022-08-01 WO PCT/JP2022/029484 patent/WO2023017752A1/ja active Application Filing
- 2022-08-01 JP JP2023541411A patent/JPWO2023017752A1/ja active Pending
- 2022-08-01 KR KR1020247007021A patent/KR20240040805A/ko unknown
Also Published As
Publication number | Publication date |
---|---|
TW202313911A (zh) | 2023-04-01 |
KR20240040805A (ko) | 2024-03-28 |
WO2023017752A1 (ja) | 2023-02-16 |