JPWO2023013468A1 - - Google Patents

Info

Publication number
JPWO2023013468A1
JPWO2023013468A1 JP2023540271A JP2023540271A JPWO2023013468A1 JP WO2023013468 A1 JPWO2023013468 A1 JP WO2023013468A1 JP 2023540271 A JP2023540271 A JP 2023540271A JP 2023540271 A JP2023540271 A JP 2023540271A JP WO2023013468 A1 JPWO2023013468 A1 JP WO2023013468A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023540271A
Other languages
Japanese (ja)
Other versions
JP7588725B2 (ja
JPWO2023013468A5 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023013468A1 publication Critical patent/JPWO2023013468A1/ja
Publication of JPWO2023013468A5 publication Critical patent/JPWO2023013468A5/ja
Priority to JP2024197369A priority Critical patent/JP2025013658A/ja
Application granted granted Critical
Publication of JP7588725B2 publication Critical patent/JP7588725B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
JP2023540271A 2021-08-06 2022-07-26 基板処理装置及び基板処理方法 Active JP7588725B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024197369A JP2025013658A (ja) 2021-08-06 2024-11-12 基板処理装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021130301 2021-08-06
JP2021130301 2021-08-06
PCT/JP2022/028734 WO2023013468A1 (ja) 2021-08-06 2022-07-26 基板処理装置及び基板処理方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024197369A Division JP2025013658A (ja) 2021-08-06 2024-11-12 基板処理装置

Publications (3)

Publication Number Publication Date
JPWO2023013468A1 true JPWO2023013468A1 (enrdf_load_stackoverflow) 2023-02-09
JPWO2023013468A5 JPWO2023013468A5 (enrdf_load_stackoverflow) 2024-04-17
JP7588725B2 JP7588725B2 (ja) 2024-11-22

Family

ID=85154479

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2023540271A Active JP7588725B2 (ja) 2021-08-06 2022-07-26 基板処理装置及び基板処理方法
JP2024197369A Pending JP2025013658A (ja) 2021-08-06 2024-11-12 基板処理装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024197369A Pending JP2025013658A (ja) 2021-08-06 2024-11-12 基板処理装置

Country Status (5)

Country Link
JP (2) JP7588725B2 (enrdf_load_stackoverflow)
KR (1) KR20240038071A (enrdf_load_stackoverflow)
CN (1) CN117769473A (enrdf_load_stackoverflow)
TW (1) TW202326839A (enrdf_load_stackoverflow)
WO (1) WO2023013468A1 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115335968A (zh) * 2020-04-02 2022-11-11 东京毅力科创株式会社 基板处理方法和基板处理装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11254169A (ja) * 1998-03-11 1999-09-21 Mitsubishi Electric Corp レーザ加工装置
JP2001321979A (ja) * 2000-05-12 2001-11-20 Matsushita Electric Ind Co Ltd レーザー穴加工機の加工粉集塵装置
WO2021131711A1 (ja) * 2019-12-26 2021-07-01 東京エレクトロン株式会社 基板処理方法及び基板処理装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4993886B2 (ja) * 2005-09-07 2012-08-08 株式会社ディスコ レーザー加工装置
JP4682872B2 (ja) * 2006-02-27 2011-05-11 株式会社デンソー レーザ加工における飛散物の除去装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11254169A (ja) * 1998-03-11 1999-09-21 Mitsubishi Electric Corp レーザ加工装置
JP2001321979A (ja) * 2000-05-12 2001-11-20 Matsushita Electric Ind Co Ltd レーザー穴加工機の加工粉集塵装置
WO2021131711A1 (ja) * 2019-12-26 2021-07-01 東京エレクトロン株式会社 基板処理方法及び基板処理装置

Also Published As

Publication number Publication date
JP7588725B2 (ja) 2024-11-22
TW202326839A (zh) 2023-07-01
JP2025013658A (ja) 2025-01-24
CN117769473A (zh) 2024-03-26
KR20240038071A (ko) 2024-03-22
WO2023013468A1 (ja) 2023-02-09

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