JPWO2023013436A1 - - Google Patents
Info
- Publication number
- JPWO2023013436A1 JPWO2023013436A1 JP2023540254A JP2023540254A JPWO2023013436A1 JP WO2023013436 A1 JPWO2023013436 A1 JP WO2023013436A1 JP 2023540254 A JP2023540254 A JP 2023540254A JP 2023540254 A JP2023540254 A JP 2023540254A JP WO2023013436 A1 JPWO2023013436 A1 JP WO2023013436A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N20/00—Machine learning
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
- G06Q10/00—Administration; Management
- G06Q10/04—Forecasting or optimisation specially adapted for administrative or management purposes, e.g. linear programming or "cutting stock problem"
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
- G06Q50/00—Information and communication technology [ICT] specially adapted for implementation of business processes of specific business sectors, e.g. utilities or tourism
- G06Q50/04—Manufacturing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Business, Economics & Management (AREA)
- Manufacturing & Machinery (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Economics (AREA)
- Human Resources & Organizations (AREA)
- Strategic Management (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Tourism & Hospitality (AREA)
- Software Systems (AREA)
- General Business, Economics & Management (AREA)
- Marketing (AREA)
- Operations Research (AREA)
- Data Mining & Analysis (AREA)
- Entrepreneurship & Innovation (AREA)
- Game Theory and Decision Science (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Primary Health Care (AREA)
- Artificial Intelligence (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Quality & Reliability (AREA)
- Evolutionary Computation (AREA)
- Medical Informatics (AREA)
- Development Economics (AREA)
- Computing Systems (AREA)
- General Engineering & Computer Science (AREA)
- Mathematical Physics (AREA)
- Management, Administration, Business Operations System, And Electronic Commerce (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021129221 | 2021-08-05 | ||
PCT/JP2022/028438 WO2023013436A1 (en) | 2021-08-05 | 2022-07-22 | Prediction method, prediction program, prediction device, learning method, learning program, and learning device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2023013436A1 true JPWO2023013436A1 (en) | 2023-02-09 |
Family
ID=85155598
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023540254A Pending JPWO2023013436A1 (en) | 2021-08-05 | 2022-07-22 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2023013436A1 (en) |
TW (1) | TW202310033A (en) |
WO (1) | WO2023013436A1 (en) |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5052033B2 (en) * | 2005-04-28 | 2012-10-17 | 株式会社半導体エネルギー研究所 | Method for manufacturing semiconductor device |
JP2009177007A (en) * | 2008-01-25 | 2009-08-06 | Panasonic Corp | Etching method of insulating film |
JP2011029443A (en) * | 2009-07-27 | 2011-02-10 | Panasonic Corp | Method and system for wet processing |
JP6106519B2 (en) * | 2013-05-09 | 2017-04-05 | 東京エレクトロン株式会社 | Substrate processing method, program, control apparatus, film forming apparatus, and substrate processing system |
WO2016104433A1 (en) * | 2014-12-26 | 2016-06-30 | 倉敷紡績株式会社 | Silicon concentration or etch selectivity measurement method and measurement device |
JP2018032781A (en) * | 2016-08-25 | 2018-03-01 | 東京応化工業株式会社 | Etchant and etching method |
JP6525044B1 (en) * | 2017-12-13 | 2019-06-05 | オムロン株式会社 | Monitoring system, learning apparatus, learning method, monitoring apparatus and monitoring method |
JP7296300B2 (en) * | 2019-10-29 | 2023-06-22 | 倉敷紡績株式会社 | Substrate etching method |
-
2022
- 2022-07-22 TW TW111127519A patent/TW202310033A/en unknown
- 2022-07-22 JP JP2023540254A patent/JPWO2023013436A1/ja active Pending
- 2022-07-22 WO PCT/JP2022/028438 patent/WO2023013436A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2023013436A1 (en) | 2023-02-09 |
TW202310033A (en) | 2023-03-01 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240122 |