JPWO2023013436A1 - - Google Patents

Info

Publication number
JPWO2023013436A1
JPWO2023013436A1 JP2023540254A JP2023540254A JPWO2023013436A1 JP WO2023013436 A1 JPWO2023013436 A1 JP WO2023013436A1 JP 2023540254 A JP2023540254 A JP 2023540254A JP 2023540254 A JP2023540254 A JP 2023540254A JP WO2023013436 A1 JPWO2023013436 A1 JP WO2023013436A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023540254A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023013436A1 publication Critical patent/JPWO2023013436A1/ja
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06NCOMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00Machine learning
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06QINFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q10/00Administration; Management
    • G06Q10/04Forecasting or optimisation specially adapted for administrative or management purposes, e.g. linear programming or "cutting stock problem"
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06QINFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q50/00Information and communication technology [ICT] specially adapted for implementation of business processes of specific business sectors, e.g. utilities or tourism
    • G06Q50/04Manufacturing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306Chemical or electrical treatment, e.g. electrolytic etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Business, Economics & Management (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Economics (AREA)
  • Human Resources & Organizations (AREA)
  • Strategic Management (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Tourism & Hospitality (AREA)
  • Software Systems (AREA)
  • General Business, Economics & Management (AREA)
  • Marketing (AREA)
  • Operations Research (AREA)
  • Data Mining & Analysis (AREA)
  • Entrepreneurship & Innovation (AREA)
  • Game Theory and Decision Science (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Primary Health Care (AREA)
  • Artificial Intelligence (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Quality & Reliability (AREA)
  • Evolutionary Computation (AREA)
  • Medical Informatics (AREA)
  • Development Economics (AREA)
  • Computing Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
  • Drying Of Semiconductors (AREA)
JP2023540254A 2021-08-05 2022-07-22 Pending JPWO2023013436A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021129221 2021-08-05
PCT/JP2022/028438 WO2023013436A1 (en) 2021-08-05 2022-07-22 Prediction method, prediction program, prediction device, learning method, learning program, and learning device

Publications (1)

Publication Number Publication Date
JPWO2023013436A1 true JPWO2023013436A1 (en) 2023-02-09

Family

ID=85155598

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023540254A Pending JPWO2023013436A1 (en) 2021-08-05 2022-07-22

Country Status (3)

Country Link
JP (1) JPWO2023013436A1 (en)
TW (1) TW202310033A (en)
WO (1) WO2023013436A1 (en)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5052033B2 (en) * 2005-04-28 2012-10-17 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
JP2009177007A (en) * 2008-01-25 2009-08-06 Panasonic Corp Etching method of insulating film
JP2011029443A (en) * 2009-07-27 2011-02-10 Panasonic Corp Method and system for wet processing
JP6106519B2 (en) * 2013-05-09 2017-04-05 東京エレクトロン株式会社 Substrate processing method, program, control apparatus, film forming apparatus, and substrate processing system
WO2016104433A1 (en) * 2014-12-26 2016-06-30 倉敷紡績株式会社 Silicon concentration or etch selectivity measurement method and measurement device
JP2018032781A (en) * 2016-08-25 2018-03-01 東京応化工業株式会社 Etchant and etching method
JP6525044B1 (en) * 2017-12-13 2019-06-05 オムロン株式会社 Monitoring system, learning apparatus, learning method, monitoring apparatus and monitoring method
JP7296300B2 (en) * 2019-10-29 2023-06-22 倉敷紡績株式会社 Substrate etching method

Also Published As

Publication number Publication date
WO2023013436A1 (en) 2023-02-09
TW202310033A (en) 2023-03-01

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240122