JPWO2023012912A1 - - Google Patents
Info
- Publication number
- JPWO2023012912A1 JPWO2023012912A1 JP2023539432A JP2023539432A JPWO2023012912A1 JP WO2023012912 A1 JPWO2023012912 A1 JP WO2023012912A1 JP 2023539432 A JP2023539432 A JP 2023539432A JP 2023539432 A JP2023539432 A JP 2023539432A JP WO2023012912 A1 JPWO2023012912 A1 JP WO2023012912A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2021/028846 WO2023012912A1 (en) | 2021-08-03 | 2021-08-03 | Component mounting nozzle and component mounting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023012912A1 true JPWO2023012912A1 (en) | 2023-02-09 |
| JPWO2023012912A5 JPWO2023012912A5 (en) | 2024-01-22 |
Family
ID=85154385
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023539432A Pending JPWO2023012912A1 (en) | 2021-08-03 | 2021-08-03 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2023012912A1 (en) |
| WO (1) | WO2023012912A1 (en) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2591022B2 (en) * | 1988-02-24 | 1997-03-19 | 松下電器産業株式会社 | Electronic component transfer equipment |
| JP2532237Y2 (en) * | 1988-07-27 | 1997-04-09 | 松下電器産業株式会社 | Nozzle unit of transfer head of electronic component mounting device |
| JP4452144B2 (en) * | 2004-08-13 | 2010-04-21 | 富士機械製造株式会社 | Electronic circuit component mounting machine |
| JP5660810B2 (en) * | 2010-06-16 | 2015-01-28 | 富士機械製造株式会社 | Adsorption nozzle inspection device for component mounting machines |
| JP6219080B2 (en) * | 2013-07-10 | 2017-10-25 | 富士機械製造株式会社 | Component mounting equipment |
| WO2015162699A1 (en) * | 2014-04-22 | 2015-10-29 | 富士機械製造株式会社 | Nozzle cleaning device and nozzle drying method |
-
2021
- 2021-08-03 JP JP2023539432A patent/JPWO2023012912A1/ja active Pending
- 2021-08-03 WO PCT/JP2021/028846 patent/WO2023012912A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023012912A1 (en) | 2023-02-09 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A529 | Written submission of copy of amendment under article 34 pct |
Free format text: JAPANESE INTERMEDIATE CODE: A5211 Effective date: 20230920 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230920 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230920 |