JPWO2023008176A1 - - Google Patents
Info
- Publication number
- JPWO2023008176A1 JPWO2023008176A1 JP2023538414A JP2023538414A JPWO2023008176A1 JP WO2023008176 A1 JPWO2023008176 A1 JP WO2023008176A1 JP 2023538414 A JP2023538414 A JP 2023538414A JP 2023538414 A JP2023538414 A JP 2023538414A JP WO2023008176 A1 JPWO2023008176 A1 JP WO2023008176A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F12/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
- C08F12/02—Monomers containing only one unsaturated aliphatic radical
- C08F12/32—Monomers containing only one unsaturated aliphatic radical containing two or more rings
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/18—Homopolymers or copolymers of aromatic monomers containing elements other than carbon and hydrogen
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D165/00—Coating compositions based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Coating compositions based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/65—Additives macromolecular
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/14—Carrier transporting layers
- H10K50/15—Hole transporting layers
- H10K50/155—Hole transporting layers comprising dopants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/17—Carrier injection layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
- H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/141—Organic polymers or oligomers comprising aliphatic or olefinic chains, e.g. poly N-vinylcarbazol, PVC or PTFE
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021121608 | 2021-07-26 | ||
| PCT/JP2022/027373 WO2023008176A1 (ja) | 2021-07-26 | 2022-07-12 | フッ素化アリールスルホン酸ポリマー化合物およびその利用 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2023008176A1 true JPWO2023008176A1 (ja) | 2023-02-02 |
Family
ID=85086783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023538414A Pending JPWO2023008176A1 (ja) | 2021-07-26 | 2022-07-12 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2023008176A1 (ja) |
| KR (1) | KR20240036640A (ja) |
| CN (1) | CN117677641A (ja) |
| TW (1) | TW202319408A (ja) |
| WO (1) | WO2023008176A1 (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023189399A1 (ja) * | 2022-03-28 | 2023-10-05 | 日産化学株式会社 | ポリマーおよびその利用 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6465123A (en) * | 1987-09-04 | 1989-03-10 | Asahi Glass Co Ltd | Electroconductive polymer and its production |
| JP4596165B2 (ja) | 2003-06-25 | 2010-12-08 | 日産化学工業株式会社 | １，４−ベンゾジオキサンスルホン酸化合物及び電子受容性物質としての利用 |
| CN101039899B (zh) | 2004-08-31 | 2010-09-29 | 日产化学工业株式会社 | 芳基磺酸化合物及其作为电子接收性物质的利用 |
| JP5262717B2 (ja) | 2006-09-13 | 2013-08-14 | 日産化学工業株式会社 | 電荷輸送性ワニス |
| KR101557109B1 (ko) | 2007-04-12 | 2015-10-02 | 닛산 가가쿠 고교 가부시키 가이샤 | 올리고아닐린 화합물 |
| TWI447099B (zh) | 2008-01-29 | 2014-08-01 | Nissan Chemical Ind Ltd | Aryl sulfonic acid compounds and the use of electron acceptables |
| WO2010062558A1 (en) * | 2008-10-27 | 2010-06-03 | Plextronics Inc. | Charge injection and transport layers |
| WO2010058777A1 (ja) | 2008-11-19 | 2010-05-27 | 日産化学工業株式会社 | 電荷輸送性材料および電荷輸送性ワニス |
| JP5723842B2 (ja) * | 2011-09-29 | 2015-05-27 | 富士フイルム株式会社 | 感活性光線性又は感放射線性樹脂組成物、それを用いたレジスト膜及びパターン形成方法、半導体デバイスの製造方法及び半導体デバイス、並びに、樹脂の製造方法 |
| JP5793489B2 (ja) * | 2011-11-30 | 2015-10-14 | 富士フイルム株式会社 | 感活性光線性又は感放射線性組成物、それを用いたレジスト膜、パターン形成方法、及び電子デバイスの製造方法 |
| JP5830493B2 (ja) * | 2012-06-27 | 2015-12-09 | 富士フイルム株式会社 | 感活性光線性又は感放射線性樹脂組成物、それを用いた感活性光線性又は感放射線性膜、パターン形成方法及び半導体デバイスの製造方法 |
| CN107615505B (zh) * | 2015-07-31 | 2021-10-15 | 积水化学工业株式会社 | 太阳能电池 |
-
2022
- 2022-07-12 KR KR1020247005705A patent/KR20240036640A/ko unknown
- 2022-07-12 CN CN202280050329.1A patent/CN117677641A/zh active Pending
- 2022-07-12 JP JP2023538414A patent/JPWO2023008176A1/ja active Pending
- 2022-07-12 WO PCT/JP2022/027373 patent/WO2023008176A1/ja active Application Filing
- 2022-07-19 TW TW111126984A patent/TW202319408A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023008176A1 (ja) | 2023-02-02 |
| KR20240036640A (ko) | 2024-03-20 |
| CN117677641A (zh) | 2024-03-08 |
| TW202319408A (zh) | 2023-05-16 |