JPWO2023008001A1 - - Google Patents
Info
- Publication number
- JPWO2023008001A1 JPWO2023008001A1 JP2023538335A JP2023538335A JPWO2023008001A1 JP WO2023008001 A1 JPWO2023008001 A1 JP WO2023008001A1 JP 2023538335 A JP2023538335 A JP 2023538335A JP 2023538335 A JP2023538335 A JP 2023538335A JP WO2023008001 A1 JPWO2023008001 A1 JP WO2023008001A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
- C08F290/14—Polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/205—Compounds containing groups, e.g. carbamates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021121445 | 2021-07-26 | ||
| PCT/JP2022/024955 WO2023008001A1 (ja) | 2021-07-26 | 2022-06-22 | 樹脂組成物、硬化物、積層体、硬化物の製造方法、積層体の製造方法、半導体デバイスの製造方法、及び、半導体デバイス |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023008001A1 true JPWO2023008001A1 (https=) | 2023-02-02 |
| JPWO2023008001A5 JPWO2023008001A5 (https=) | 2024-04-16 |
Family
ID=85086680
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023538335A Pending JPWO2023008001A1 (https=) | 2021-07-26 | 2022-06-22 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2023008001A1 (https=) |
| CN (1) | CN117715982A (https=) |
| TW (1) | TW202307091A (https=) |
| WO (1) | WO2023008001A1 (https=) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050087167A (ko) * | 2004-02-25 | 2005-08-31 | 심우철 | 가공성, 투명성 및 열안정성이 우수한폴리이미드/폴리카보네이트 알로이 수지 조성물 |
| JP2006077064A (ja) * | 2004-09-08 | 2006-03-23 | Kaneka Corp | 新規ポリイミド、ポリイミド樹脂組成物、およびそれを用いた難燃性樹脂組成物、並びにポリアミド酸 |
| JP2010254982A (ja) * | 2009-03-31 | 2010-11-11 | Dainippon Printing Co Ltd | 塩基発生剤、樹脂組成物、当該樹脂組成物からなるパターン形成用材料、当該樹脂組成物を用いたパターン形成方法並びに物品 |
| JP2016212380A (ja) * | 2015-04-28 | 2016-12-15 | 富士フイルム株式会社 | 感光性樹脂組成物、硬化膜の製造方法、硬化膜、液晶表示装置、有機エレクトロルミネッセンス表示装置およびタッチパネル |
| JP2018065809A (ja) * | 2015-12-09 | 2018-04-26 | 学校法人東京理科大学 | 新規化合物、及び該化合物の製造方法 |
| WO2020026840A1 (ja) * | 2018-07-31 | 2020-02-06 | 旭化成株式会社 | ネガ型感光性樹脂組成物、並びにこれを用いたポリイミド及び硬化レリーフパターンの製造方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7038223B2 (ja) * | 2018-09-26 | 2022-03-17 | 富士フイルム株式会社 | 感光性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、半導体デバイス、および熱塩基発生剤 |
-
2022
- 2022-06-22 CN CN202280052243.2A patent/CN117715982A/zh active Pending
- 2022-06-22 JP JP2023538335A patent/JPWO2023008001A1/ja active Pending
- 2022-06-22 WO PCT/JP2022/024955 patent/WO2023008001A1/ja not_active Ceased
- 2022-06-27 TW TW111123877A patent/TW202307091A/zh unknown
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050087167A (ko) * | 2004-02-25 | 2005-08-31 | 심우철 | 가공성, 투명성 및 열안정성이 우수한폴리이미드/폴리카보네이트 알로이 수지 조성물 |
| JP2006077064A (ja) * | 2004-09-08 | 2006-03-23 | Kaneka Corp | 新規ポリイミド、ポリイミド樹脂組成物、およびそれを用いた難燃性樹脂組成物、並びにポリアミド酸 |
| JP2010254982A (ja) * | 2009-03-31 | 2010-11-11 | Dainippon Printing Co Ltd | 塩基発生剤、樹脂組成物、当該樹脂組成物からなるパターン形成用材料、当該樹脂組成物を用いたパターン形成方法並びに物品 |
| JP2016212380A (ja) * | 2015-04-28 | 2016-12-15 | 富士フイルム株式会社 | 感光性樹脂組成物、硬化膜の製造方法、硬化膜、液晶表示装置、有機エレクトロルミネッセンス表示装置およびタッチパネル |
| JP2018065809A (ja) * | 2015-12-09 | 2018-04-26 | 学校法人東京理科大学 | 新規化合物、及び該化合物の製造方法 |
| WO2020026840A1 (ja) * | 2018-07-31 | 2020-02-06 | 旭化成株式会社 | ネガ型感光性樹脂組成物、並びにこれを用いたポリイミド及び硬化レリーフパターンの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023008001A1 (ja) | 2023-02-02 |
| TW202307091A (zh) | 2023-02-16 |
| CN117715982A (zh) | 2024-03-15 |
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