JPWO2023007797A1 - - Google Patents
Info
- Publication number
- JPWO2023007797A1 JPWO2023007797A1 JP2023538233A JP2023538233A JPWO2023007797A1 JP WO2023007797 A1 JPWO2023007797 A1 JP WO2023007797A1 JP 2023538233 A JP2023538233 A JP 2023538233A JP 2023538233 A JP2023538233 A JP 2023538233A JP WO2023007797 A1 JPWO2023007797 A1 JP WO2023007797A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14636—Interconnect structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14634—Assemblies, i.e. Hybrid structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/1469—Assemblies, i.e. hybrid integration
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021122123 | 2021-07-27 | ||
| PCT/JP2022/008491 WO2023007797A1 (ja) | 2021-07-27 | 2022-03-01 | 固体撮像素子、撮像装置、および電子機器 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2023007797A1 true JPWO2023007797A1 (ja) | 2023-02-02 |
Family
ID=85086578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023538233A Pending JPWO2023007797A1 (ja) | 2021-07-27 | 2022-03-01 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2023007797A1 (ja) |
| KR (1) | KR20240035449A (ja) |
| CN (1) | CN117652029A (ja) |
| DE (1) | DE112022003725T5 (ja) |
| WO (1) | WO2023007797A1 (ja) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6102941B2 (ja) * | 2012-11-30 | 2017-03-29 | パナソニック株式会社 | 光学装置及びその製造方法 |
| JP7184772B2 (ja) * | 2017-07-18 | 2022-12-06 | ソニーセミコンダクタソリューションズ株式会社 | 撮像装置および撮像装置の製造方法 |
| TW202315106A (zh) * | 2017-10-30 | 2023-04-01 | 日商索尼半導體解決方案公司 | 固體攝像裝置及電子機器 |
| US20220157865A1 (en) * | 2019-03-13 | 2022-05-19 | Sony Semiconductor Solutions Corporation | Semiconductor apparatus, imaging apparatus, and method of producing a semiconductor apparatus |
| JP2021089979A (ja) * | 2019-12-04 | 2021-06-10 | ソニーセミコンダクタソリューションズ株式会社 | 半導体素子および電子機器 |
-
2022
- 2022-03-01 JP JP2023538233A patent/JPWO2023007797A1/ja active Pending
- 2022-03-01 WO PCT/JP2022/008491 patent/WO2023007797A1/ja active Application Filing
- 2022-03-01 DE DE112022003725.3T patent/DE112022003725T5/de active Pending
- 2022-03-01 CN CN202280048904.4A patent/CN117652029A/zh active Pending
- 2022-03-01 KR KR1020247000816A patent/KR20240035449A/ko unknown
Also Published As
| Publication number | Publication date |
|---|---|
| DE112022003725T5 (de) | 2024-05-16 |
| WO2023007797A1 (ja) | 2023-02-02 |
| KR20240035449A (ko) | 2024-03-15 |
| CN117652029A (zh) | 2024-03-05 |