JPWO2022091615A1 - - Google Patents
Info
- Publication number
- JPWO2022091615A1 JPWO2022091615A1 JP2022558904A JP2022558904A JPWO2022091615A1 JP WO2022091615 A1 JPWO2022091615 A1 JP WO2022091615A1 JP 2022558904 A JP2022558904 A JP 2022558904A JP 2022558904 A JP2022558904 A JP 2022558904A JP WO2022091615 A1 JPWO2022091615 A1 JP WO2022091615A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14636—Interconnect structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14634—Assemblies, i.e. Hybrid structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1464—Back illuminated imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/1469—Assemblies, i.e. hybrid integration
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020178823 | 2020-10-26 | ||
| PCT/JP2021/033839 WO2022091615A1 (ja) | 2020-10-26 | 2021-09-15 | 固体撮像装置及び固体撮像装置の製造方法、並びに電子機器 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022091615A1 true JPWO2022091615A1 (ja) | 2022-05-05 |
Family
ID=81382344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022558904A Pending JPWO2022091615A1 (ja) | 2020-10-26 | 2021-09-15 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20230395636A1 (ja) |
| JP (1) | JPWO2022091615A1 (ja) |
| CN (1) | CN116349241A (ja) |
| WO (1) | WO2022091615A1 (ja) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9899443B2 (en) * | 2016-07-22 | 2018-02-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Complementary metal-oxide-semiconductor (CMOS) image sensor (CIS) package with an image buffer |
| TWI788430B (zh) * | 2017-10-30 | 2023-01-01 | 日商索尼半導體解決方案公司 | 背面照射型之固體攝像裝置、背面照射型之固體攝像裝置之製造方法、攝像裝置及電子機器 |
| KR102511008B1 (ko) * | 2018-01-11 | 2023-03-17 | 삼성전자주식회사 | 반도체 패키지 |
| TW202101744A (zh) * | 2018-12-20 | 2021-01-01 | 日商索尼半導體解決方案公司 | 背面照射型固體攝像裝置、背面照射型固體攝像裝置之製造方法、攝像裝置及電子機器 |
| JP2020150112A (ja) * | 2019-03-13 | 2020-09-17 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像素子 |
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2021
- 2021-09-15 US US18/248,951 patent/US20230395636A1/en active Pending
- 2021-09-15 CN CN202180071346.9A patent/CN116349241A/zh active Pending
- 2021-09-15 WO PCT/JP2021/033839 patent/WO2022091615A1/ja active Application Filing
- 2021-09-15 JP JP2022558904A patent/JPWO2022091615A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN116349241A (zh) | 2023-06-27 |
| US20230395636A1 (en) | 2023-12-07 |
| WO2022091615A1 (ja) | 2022-05-05 |