JPWO2022264546A1 - - Google Patents
Info
- Publication number
- JPWO2022264546A1 JPWO2022264546A1 JP2023529533A JP2023529533A JPWO2022264546A1 JP WO2022264546 A1 JPWO2022264546 A1 JP WO2022264546A1 JP 2023529533 A JP2023529533 A JP 2023529533A JP 2023529533 A JP2023529533 A JP 2023529533A JP WO2022264546 A1 JPWO2022264546 A1 JP WO2022264546A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021100176 | 2021-06-16 | ||
| PCT/JP2022/009950 WO2022264546A1 (fr) | 2021-06-16 | 2022-03-08 | Feuille électroconductrice et film de découpage en dés/fixation de puces |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022264546A1 true JPWO2022264546A1 (fr) | 2022-12-22 |
Family
ID=84526072
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023529533A Pending JPWO2022264546A1 (fr) | 2021-06-16 | 2022-03-08 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2022264546A1 (fr) |
| CN (1) | CN117321744A (fr) |
| TW (1) | TW202300605A (fr) |
| WO (1) | WO2022264546A1 (fr) |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4785095B2 (ja) * | 2009-08-25 | 2011-10-05 | 古河電気工業株式会社 | ウエハ加工用テープ |
| JP2012079936A (ja) * | 2010-10-01 | 2012-04-19 | Nitto Denko Corp | ダイシング・ダイボンドフィルム、及び、半導体装置の製造方法 |
| KR101787926B1 (ko) * | 2013-10-15 | 2017-10-18 | 미쓰비시덴키 가부시키가이샤 | 반도체 소자의 제조 방법, 웨이퍼 마운트 장치 |
| JP6073263B2 (ja) * | 2014-03-31 | 2017-02-01 | 日東電工株式会社 | ダイシングシート付きダイボンドフィルム、及び、半導体装置の製造方法 |
| JP5908543B2 (ja) * | 2014-08-07 | 2016-04-26 | 日東電工株式会社 | 半導体装置の製造方法 |
| JP6396189B2 (ja) * | 2014-11-27 | 2018-09-26 | 日東電工株式会社 | 導電性フィルム状接着剤、フィルム状接着剤付きダイシングテープ及び半導体装置の製造方法 |
| JP2016125043A (ja) * | 2015-01-08 | 2016-07-11 | 積水化学工業株式会社 | 半導体ウエハ用接着フィルム |
| JP2017045935A (ja) * | 2015-08-28 | 2017-03-02 | 日立化成株式会社 | 接着シートとダイシングテープを用いる半導体装置の製造方法 |
| CN110476233B (zh) * | 2017-03-29 | 2023-09-29 | 日东电工株式会社 | 加热接合用片和带有加热接合用片的切割带 |
| WO2019092959A1 (fr) * | 2017-11-13 | 2019-05-16 | 日東電工株式会社 | Composition pour liaison par frittage, feuille pour liaison par frittage, et bande de découpage en dés avec feuille pour liaison par frittage |
| JP7046585B2 (ja) * | 2017-12-14 | 2022-04-04 | 日東電工株式会社 | 接着フィルムおよびダイシングテープ付き接着フィルム |
| JPWO2020189535A1 (fr) * | 2019-03-15 | 2020-09-24 | ||
| JP7190418B2 (ja) * | 2019-11-08 | 2022-12-15 | 日東電工株式会社 | 熱硬化性シート及びダイシングダイボンドフィルム |
-
2022
- 2022-03-08 JP JP2023529533A patent/JPWO2022264546A1/ja active Pending
- 2022-03-08 CN CN202280035889.XA patent/CN117321744A/zh active Pending
- 2022-03-08 WO PCT/JP2022/009950 patent/WO2022264546A1/fr active Application Filing
- 2022-04-12 TW TW111113808A patent/TW202300605A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN117321744A (zh) | 2023-12-29 |
| TW202300605A (zh) | 2023-01-01 |
| WO2022264546A1 (fr) | 2022-12-22 |