JPWO2022264353A1 - - Google Patents

Info

Publication number
JPWO2022264353A1
JPWO2022264353A1 JP2021559593A JP2021559593A JPWO2022264353A1 JP WO2022264353 A1 JPWO2022264353 A1 JP WO2022264353A1 JP 2021559593 A JP2021559593 A JP 2021559593A JP 2021559593 A JP2021559593 A JP 2021559593A JP WO2022264353 A1 JPWO2022264353 A1 JP WO2022264353A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021559593A
Other languages
Japanese (ja)
Other versions
JP7027622B1 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Application granted granted Critical
Publication of JP7027622B1 publication Critical patent/JP7027622B1/ja
Publication of JPWO2022264353A1 publication Critical patent/JPWO2022264353A1/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/08—Rinsing
JP2021559593A 2021-06-17 2021-06-17 抵抗体、及び、めっき装置 Active JP7027622B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/023016 WO2022264353A1 (ja) 2021-06-17 2021-06-17 抵抗体、及び、めっき装置

Publications (2)

Publication Number Publication Date
JP7027622B1 JP7027622B1 (ja) 2022-03-01
JPWO2022264353A1 true JPWO2022264353A1 (ko) 2022-12-22

Family

ID=81183867

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021559593A Active JP7027622B1 (ja) 2021-06-17 2021-06-17 抵抗体、及び、めっき装置

Country Status (4)

Country Link
JP (1) JP7027622B1 (ko)
KR (1) KR102421505B1 (ko)
CN (1) CN114729467A (ko)
WO (1) WO2022264353A1 (ko)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3836588B2 (ja) * 1997-11-19 2006-10-25 株式会社荏原製作所 ウエハのメッキ装置
JP2002054000A (ja) * 2000-08-02 2002-02-19 Nitto Denko Corp 基板の電解めっき方法
JP2002235188A (ja) * 2001-02-05 2002-08-23 Tokyo Electron Ltd 液処理装置、液処理方法
US20040262150A1 (en) * 2002-07-18 2004-12-30 Toshikazu Yajima Plating device
JP2004225129A (ja) * 2003-01-24 2004-08-12 Ebara Corp めっき方法及びめっき装置
JP2008019496A (ja) 2006-07-14 2008-01-31 Matsushita Electric Ind Co Ltd 電解めっき装置および電解めっき方法
TW200839038A (en) * 2007-03-26 2008-10-01 Semi Photonics Co Ltd Device and method with improved plating film thickness uniformity
JP5507649B2 (ja) * 2012-11-15 2014-05-28 株式会社荏原製作所 磁性体膜めっき装置及びめっき処理設備
EP2746432A1 (en) * 2012-12-20 2014-06-25 Atotech Deutschland GmbH Device for vertical galvanic metal deposition on a substrate
JP6317299B2 (ja) * 2015-08-28 2018-04-25 株式会社荏原製作所 めっき装置、めっき方法、及び基板ホルダ
WO2022102119A1 (ja) * 2020-11-16 2022-05-19 株式会社荏原製作所 プレート、めっき装置、及びプレートの製造方法
WO2022137277A1 (ja) * 2020-12-21 2022-06-30 株式会社荏原製作所 めっき装置及びめっき液の撹拌方法

Also Published As

Publication number Publication date
WO2022264353A1 (ja) 2022-12-22
KR102421505B1 (ko) 2022-07-15
JP7027622B1 (ja) 2022-03-01
CN114729467A (zh) 2022-07-08

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