JPWO2022259963A1 - - Google Patents
Info
- Publication number
- JPWO2022259963A1 JPWO2022259963A1 JP2023527832A JP2023527832A JPWO2022259963A1 JP WO2022259963 A1 JPWO2022259963 A1 JP WO2022259963A1 JP 2023527832 A JP2023527832 A JP 2023527832A JP 2023527832 A JP2023527832 A JP 2023527832A JP WO2022259963 A1 JPWO2022259963 A1 JP WO2022259963A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/60—Preliminary treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/222—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by pressing, e.g. presses
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic materials other than metals or composite materials
- B23K2103/54—Glass
Landscapes
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Plasma & Fusion (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mining & Mineral Resources (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021098236 | 2021-06-11 | ||
| PCT/JP2022/022563 WO2022259963A1 (ja) | 2021-06-11 | 2022-06-02 | ガラス物品の製造方法、ガラス物品、カバーガラス、及び表示装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022259963A1 true JPWO2022259963A1 (https=) | 2022-12-15 |
Family
ID=84426064
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023527832A Pending JPWO2022259963A1 (https=) | 2021-06-11 | 2022-06-02 |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP4353691A4 (https=) |
| JP (1) | JPWO2022259963A1 (https=) |
| CN (1) | CN117480132A (https=) |
| TW (1) | TW202302262A (https=) |
| WO (1) | WO2022259963A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IT202400003454A1 (it) * | 2024-02-19 | 2025-08-19 | Claudio Bernabucci | Procedimento e dispositivo per taglio del vetro specie vetro borosilicato e vetroceramica |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003088982A (ja) * | 2002-03-29 | 2003-03-25 | Hamamatsu Photonics Kk | レーザ加工方法 |
| JP2011056544A (ja) * | 2009-09-10 | 2011-03-24 | Aisin Seiki Co Ltd | レーザ加工方法及びレーザ加工装置 |
| JP2012146878A (ja) * | 2011-01-13 | 2012-08-02 | Hamamatsu Photonics Kk | レーザ加工方法 |
| JP2017128493A (ja) * | 2015-09-04 | 2017-07-27 | 旭硝子株式会社 | ガラス板の製造方法、ガラス物品の製造方法、ガラス板、ガラス物品、およびガラス物品の製造装置 |
| JP2017528322A (ja) * | 2014-07-09 | 2017-09-28 | ハイ キュー レーザー ゲゼルシャフト ミット ベシュレンクテル ハフツングＨｉｇｈ Ｑ Ｌａｓｅｒ ＧｍｂＨ | 非円形レーザビームを用いる材料の処理 |
| JP2017174941A (ja) * | 2016-03-23 | 2017-09-28 | 浜松ホトニクス株式会社 | レーザ加工方法及びレーザ加工装置 |
| JP2019196285A (ja) * | 2018-05-10 | 2019-11-14 | 株式会社ディスコ | チップの製造方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5056839B2 (ja) * | 2009-12-25 | 2012-10-24 | 三星ダイヤモンド工業株式会社 | 被加工物の加工方法および被加工物の分割方法 |
| RU2013102422A (ru) | 2010-07-12 | 2014-08-20 | ФАЙЛЭЙСЕР ЮЭс-Эй ЭлЭлСи | Способ обработки материалов с использованием филаментации |
| JP5760251B2 (ja) * | 2011-04-06 | 2015-08-05 | 株式会社ブイ・テクノロジー | ガラス基板のレーザ加工装置 |
| JP2015156427A (ja) * | 2014-02-20 | 2015-08-27 | アイシン精機株式会社 | ガラス加工部品及びその製造方法並びに電子装置及びその製造方法 |
| CN107922259B (zh) * | 2015-09-04 | 2021-05-07 | Ａｇｃ株式会社 | 玻璃板的制造方法、玻璃板、玻璃物品的制造方法、玻璃物品以及玻璃物品的制造装置 |
| PL3508458T3 (pl) * | 2016-09-01 | 2022-06-13 | AGC Inc. | Sposób wytwarzania wyrobu szklanego |
| DE202019005592U1 (de) * | 2019-01-22 | 2021-02-08 | Hegla Gmbh & Co. Kg | Vorrichtung zum Bearbeiten und zum Trennen einer Verbundsicherheitsglastafel |
| JP7413001B2 (ja) | 2019-12-20 | 2024-01-15 | デクセリアルズ株式会社 | ロール金型製造方法、ロール金型製造装置およびプログラム |
-
2022
- 2022-06-02 CN CN202280040916.2A patent/CN117480132A/zh active Pending
- 2022-06-02 WO PCT/JP2022/022563 patent/WO2022259963A1/ja not_active Ceased
- 2022-06-02 JP JP2023527832A patent/JPWO2022259963A1/ja active Pending
- 2022-06-02 EP EP22820144.8A patent/EP4353691A4/en active Pending
- 2022-06-07 TW TW111120982A patent/TW202302262A/zh unknown
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003088982A (ja) * | 2002-03-29 | 2003-03-25 | Hamamatsu Photonics Kk | レーザ加工方法 |
| JP2011056544A (ja) * | 2009-09-10 | 2011-03-24 | Aisin Seiki Co Ltd | レーザ加工方法及びレーザ加工装置 |
| JP2012146878A (ja) * | 2011-01-13 | 2012-08-02 | Hamamatsu Photonics Kk | レーザ加工方法 |
| JP2017528322A (ja) * | 2014-07-09 | 2017-09-28 | ハイ キュー レーザー ゲゼルシャフト ミット ベシュレンクテル ハフツングＨｉｇｈ Ｑ Ｌａｓｅｒ ＧｍｂＨ | 非円形レーザビームを用いる材料の処理 |
| JP2017128493A (ja) * | 2015-09-04 | 2017-07-27 | 旭硝子株式会社 | ガラス板の製造方法、ガラス物品の製造方法、ガラス板、ガラス物品、およびガラス物品の製造装置 |
| JP2017174941A (ja) * | 2016-03-23 | 2017-09-28 | 浜松ホトニクス株式会社 | レーザ加工方法及びレーザ加工装置 |
| JP2019196285A (ja) * | 2018-05-10 | 2019-11-14 | 株式会社ディスコ | チップの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP4353691A1 (en) | 2024-04-17 |
| EP4353691A4 (en) | 2025-06-18 |
| TW202302262A (zh) | 2023-01-16 |
| CN117480132A (zh) | 2024-01-30 |
| WO2022259963A1 (ja) | 2022-12-15 |
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