JPWO2022259746A1 - - Google Patents
Info
- Publication number
- JPWO2022259746A1 JPWO2022259746A1 JP2023527543A JP2023527543A JPWO2022259746A1 JP WO2022259746 A1 JPWO2022259746 A1 JP WO2022259746A1 JP 2023527543 A JP2023527543 A JP 2023527543A JP 2023527543 A JP2023527543 A JP 2023527543A JP WO2022259746 A1 JPWO2022259746 A1 JP WO2022259746A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021095046 | 2021-06-07 | ||
JP2021095046 | 2021-06-07 | ||
PCT/JP2022/016746 WO2022259746A1 (fr) | 2021-06-07 | 2022-03-31 | Circuit de sortie de tension analogique et dispositif à semi-conducteur |
Publications (3)
Publication Number | Publication Date |
---|---|
JPWO2022259746A1 true JPWO2022259746A1 (fr) | 2022-12-15 |
JPWO2022259746A5 JPWO2022259746A5 (fr) | 2023-09-05 |
JP7531708B2 JP7531708B2 (ja) | 2024-08-09 |
Family
ID=84425213
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023527543A Active JP7531708B2 (ja) | 2021-06-07 | 2022-03-31 | アナログ電圧出力回路、及び、半導体装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP7531708B2 (fr) |
WO (1) | WO2022259746A1 (fr) |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04263449A (ja) * | 1991-02-18 | 1992-09-18 | Sumitomo Electric Ind Ltd | プローブヘッド回路を有する集積回路 |
US6430087B1 (en) * | 2000-02-28 | 2002-08-06 | Advanced Micro Devices, Inc. | Trimming method and system for wordline booster to minimize process variation of boosted wordline voltage |
US7388183B2 (en) * | 2002-08-23 | 2008-06-17 | Micron Technology, Inc. | Low dark current pixel with a guard drive active photodiode |
JP2004295705A (ja) * | 2003-03-28 | 2004-10-21 | Citizen Watch Co Ltd | 定電圧電源回路およびこれを用いた電子時計 |
JP2006293344A (ja) | 2005-03-18 | 2006-10-26 | Semiconductor Energy Lab Co Ltd | 半導体装置、表示装置及びその駆動方法並びに電子機器 |
JP4091086B2 (ja) * | 2006-04-24 | 2008-05-28 | 株式会社ルネサステクノロジ | 半導体集積回路及びマイクロコンピュータ |
JP2018042080A (ja) * | 2016-09-07 | 2018-03-15 | 株式会社リコー | 増幅回路及び駆動装置 |
US10763664B2 (en) * | 2018-06-21 | 2020-09-01 | Texas Instruments Incorporated | Driver and slew-rate-control circuit providing soft start after recovery from short |
US11508719B2 (en) * | 2019-05-13 | 2022-11-22 | Ememory Technology Inc. | Electrostatic discharge circuit |
JP2022069919A (ja) * | 2020-10-26 | 2022-05-12 | 三菱電機株式会社 | 電源回路 |
-
2022
- 2022-03-31 WO PCT/JP2022/016746 patent/WO2022259746A1/fr active Application Filing
- 2022-03-31 JP JP2023527543A patent/JP7531708B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP7531708B2 (ja) | 2024-08-09 |
WO2022259746A1 (fr) | 2022-12-15 |
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