JPWO2022255338A1 - - Google Patents

Info

Publication number
JPWO2022255338A1
JPWO2022255338A1 JP2022575288A JP2022575288A JPWO2022255338A1 JP WO2022255338 A1 JPWO2022255338 A1 JP WO2022255338A1 JP 2022575288 A JP2022575288 A JP 2022575288A JP 2022575288 A JP2022575288 A JP 2022575288A JP WO2022255338 A1 JPWO2022255338 A1 JP WO2022255338A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022575288A
Other languages
Japanese (ja)
Other versions
JP7737406B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022255338A1 publication Critical patent/JPWO2022255338A1/ja
Priority to JP2023094578A priority Critical patent/JP2023123545A/ja
Application granted granted Critical
Publication of JP7737406B2 publication Critical patent/JP7737406B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D73/00—Packages comprising articles attached to cards, sheets or webs
    • B65D73/02—Articles, e.g. small electrical components, attached to webs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D75/00—Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes or webs of flexible sheet material, e.g. in folded wrappers
    • B65D75/28—Articles or materials wholly enclosed in composite wrappers, i.e. wrappers formed by associating or interconnecting two or more sheets or blanks
    • B65D75/30—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding
    • B65D75/32—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents
    • B65D75/36—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet or blank being recessed and the other formed of relatively stiff flat sheet material, e.g. blister packages, the recess or recesses being preformed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Packaging Frangible Articles (AREA)
  • Packages (AREA)
  • Laminated Bodies (AREA)
  • Wrappers (AREA)
JP2022575288A 2021-05-31 2022-05-31 電子部品包装用カバーテープおよび包装体 Active JP7737406B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023094578A JP2023123545A (ja) 2021-05-31 2023-06-08 電子部品包装用カバーテープおよび包装体

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021091196 2021-05-31
JP2021091196 2021-05-31
PCT/JP2022/022064 WO2022255338A1 (ja) 2021-05-31 2022-05-31 電子部品包装用カバーテープおよび包装体

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023094578A Division JP2023123545A (ja) 2021-05-31 2023-06-08 電子部品包装用カバーテープおよび包装体

Publications (2)

Publication Number Publication Date
JPWO2022255338A1 true JPWO2022255338A1 (enrdf_load_stackoverflow) 2022-12-08
JP7737406B2 JP7737406B2 (ja) 2025-09-10

Family

ID=

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004094258A1 (ja) * 2003-04-24 2004-11-04 Dai Nippon Printing Co., Ltd. 電子部品のテーピング包装用カバーテープ
JP2006008152A (ja) * 2004-06-23 2006-01-12 Denki Kagaku Kogyo Kk カバーテープ
JP2006219137A (ja) * 2005-02-08 2006-08-24 Sumitomo Bakelite Co Ltd 電子部品包装用カバーテープ
JP2020055627A (ja) * 2018-09-28 2020-04-09 住友ベークライト株式会社 カバーテープおよび電子部品用包装体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004094258A1 (ja) * 2003-04-24 2004-11-04 Dai Nippon Printing Co., Ltd. 電子部品のテーピング包装用カバーテープ
JP2006008152A (ja) * 2004-06-23 2006-01-12 Denki Kagaku Kogyo Kk カバーテープ
JP2006219137A (ja) * 2005-02-08 2006-08-24 Sumitomo Bakelite Co Ltd 電子部品包装用カバーテープ
JP2020055627A (ja) * 2018-09-28 2020-04-09 住友ベークライト株式会社 カバーテープおよび電子部品用包装体

Also Published As

Publication number Publication date
TWI836456B (zh) 2024-03-21
TW202304270A (zh) 2023-01-16
JP2023123545A (ja) 2023-09-05
WO2022255338A1 (ja) 2022-12-08

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