JPWO2022254856A1 - - Google Patents
Info
- Publication number
- JPWO2022254856A1 JPWO2022254856A1 JP2023525410A JP2023525410A JPWO2022254856A1 JP WO2022254856 A1 JPWO2022254856 A1 JP WO2022254856A1 JP 2023525410 A JP2023525410 A JP 2023525410A JP 2023525410 A JP2023525410 A JP 2023525410A JP WO2022254856 A1 JPWO2022254856 A1 JP WO2022254856A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021094673 | 2021-06-04 | ||
PCT/JP2022/010113 WO2022254856A1 (ja) | 2021-06-04 | 2022-03-08 | ワークの両面研磨装置および両面研磨方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022254856A1 true JPWO2022254856A1 (ja) | 2022-12-08 |
Family
ID=84324224
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023525410A Pending JPWO2022254856A1 (ja) | 2021-06-04 | 2022-03-08 |
Country Status (6)
Country | Link |
---|---|
JP (1) | JPWO2022254856A1 (ja) |
KR (1) | KR20240001252A (ja) |
CN (1) | CN117769477A (ja) |
DE (1) | DE112022002923T5 (ja) |
TW (1) | TWI813268B (ja) |
WO (1) | WO2022254856A1 (ja) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006032455A1 (de) * | 2006-07-13 | 2008-04-10 | Siltronic Ag | Verfahren zum gleichzeitigen beidseitigen Schleifen mehrerer Halbleiterscheiben sowie Halbleierscheibe mit hervorragender Ebenheit |
JP4654275B2 (ja) | 2008-07-31 | 2011-03-16 | 信越半導体株式会社 | 両面研磨装置 |
JP6101175B2 (ja) * | 2013-08-28 | 2017-03-22 | Sumco Techxiv株式会社 | 半導体ウェーハの研磨方法 |
KR101660900B1 (ko) * | 2015-01-16 | 2016-10-10 | 주식회사 엘지실트론 | 웨이퍼 연마 장치 및 이를 이용한 웨이퍼 연마 방법 |
JP6844530B2 (ja) * | 2017-12-28 | 2021-03-17 | 株式会社Sumco | ワークの両面研磨装置および両面研磨方法 |
JP7010166B2 (ja) * | 2018-07-24 | 2022-01-26 | 株式会社Sumco | ワークの両面研磨装置および両面研磨方法 |
-
2022
- 2022-03-08 JP JP2023525410A patent/JPWO2022254856A1/ja active Pending
- 2022-03-08 WO PCT/JP2022/010113 patent/WO2022254856A1/ja active Application Filing
- 2022-03-08 DE DE112022002923.4T patent/DE112022002923T5/de active Pending
- 2022-03-08 KR KR1020237041346A patent/KR20240001252A/ko unknown
- 2022-03-08 CN CN202280040078.9A patent/CN117769477A/zh active Pending
- 2022-04-26 TW TW111115766A patent/TWI813268B/zh active
Also Published As
Publication number | Publication date |
---|---|
DE112022002923T5 (de) | 2024-03-14 |
TWI813268B (zh) | 2023-08-21 |
KR20240001252A (ko) | 2024-01-03 |
TW202300282A (zh) | 2023-01-01 |
WO2022254856A1 (ja) | 2022-12-08 |
CN117769477A (zh) | 2024-03-26 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230823 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20240604 |