JPWO2022250088A1 - - Google Patents

Info

Publication number
JPWO2022250088A1
JPWO2022250088A1 JP2023523509A JP2023523509A JPWO2022250088A1 JP WO2022250088 A1 JPWO2022250088 A1 JP WO2022250088A1 JP 2023523509 A JP2023523509 A JP 2023523509A JP 2023523509 A JP2023523509 A JP 2023523509A JP WO2022250088 A1 JPWO2022250088 A1 JP WO2022250088A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023523509A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022250088A1 publication Critical patent/JPWO2022250088A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
JP2023523509A 2021-05-26 2022-05-25 Pending JPWO2022250088A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021088566 2021-05-26
PCT/JP2022/021420 WO2022250088A1 (en) 2021-05-26 2022-05-25 Printed board and method for producing same

Publications (1)

Publication Number Publication Date
JPWO2022250088A1 true JPWO2022250088A1 (en) 2022-12-01

Family

ID=84230110

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023523509A Pending JPWO2022250088A1 (en) 2021-05-26 2022-05-25

Country Status (2)

Country Link
JP (1) JPWO2022250088A1 (en)
WO (1) WO2022250088A1 (en)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6362294A (en) * 1986-09-02 1988-03-18 三菱電機株式会社 Printed wiring board
JPH0521944A (en) * 1991-07-12 1993-01-29 Canon Inc Printed-wiring board
JP2000101222A (en) * 1998-09-21 2000-04-07 Mitsubishi Electric Corp Printed wiring board and producing method therefor
WO2005122655A2 (en) * 2004-06-09 2005-12-22 Koninklijke Philips Electronics N.V. Pcb including a star shaped through-hole solder pad
JP5003839B1 (en) * 2011-09-21 2012-08-15 富士ゼロックス株式会社 Method for manufacturing printed wiring board device
JP2015088531A (en) * 2013-10-29 2015-05-07 シャープ株式会社 Manufacturing method of printed circuit board, printed circuit board, and display device
WO2016100984A1 (en) * 2014-12-19 2016-06-23 Walker Myron Spoked solder pad to improve solderability and self-alignment of integrated circuit packages
JP7155214B2 (en) * 2020-09-28 2022-10-18 キヤノン株式会社 Printed circuit boards and electronics

Also Published As

Publication number Publication date
WO2022250088A1 (en) 2022-12-01

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230616